SMTA International 1999 Proceedings

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    TITLE AUTHOR DOWNLOAD
    MODEL OF PROCESS CAPABILITY OF SOLDER PASTE PRINTING A. Paproth  Purchase 
    MANUFACTURING ROBUSTNESS OF CSP ON AN SMT LINE Alex Chen  Purchase 
    CHALLENGES IN HIGH-DENSITY PCB ASSEMBLY: NEW STRATEGIES FOR IMPROVING QUALITY INSPECTION AND TEST Ana I. De Marco  Purchase 
    SELECTIVE SOLDERING WITH LASER OR MINI-WAVE Armin Rahn  Purchase 
    ALTERNATIVE FINANCING STRATEGIES OF EACH STAGE OF THE OUTSOURCED PROCESS Barry Cohen  Purchase 
    THE IMPACT MULTIMEDIA HAS HAD ON PRODUCTIVITY Belinda Bittner  Purchase 
    TEST STRATEGIES FOR COMPLEX ELECTRONIC ASSEMBLY: EVALUATING AND IMPLEMENTING FLYING PROBE TECHNOLOGY Bernard McAvinue  Purchase 
    REQUIREMENTS FOR RELIABLE BGA SUBSTRATES FOR WIREBOND, FLIP CHIP AND SOLDERING Bernd Guenther  Purchase 
    LINKING THE LINKS: CREATING THE “VALUE” IN THE HIGH-MIX VALUE CHAIN Brian Tracey  Purchase 
    INTRODUCING THE IPC/JPCA-4104 SPECIFICATIONS FOR HIGH DENSITY INTERCONNECT /MICROVIA MATERIALS Ceferino G. Gonzalez  Purchase 
    THERMOGRAVIMETRIC ANALYSIS PREDICTIONS OF REFLOW PROFILE OF SOLDER PASTES Charles Bradshaw  Purchase 
    INERTING THE WAVE SOLDERING PROCESS WITH MEMBRANE-GENERATED NITROGEN Chrys Shea  Purchase 
    A PRODUCT COST QUOTATION SYSTEM FOR CONTRACT ELECTRONICS MANUFACTURERS Daryl Santos  Purchase 
    EXPERIMENT-BASED COMPUTATIONAL INVESTIGATION OF THERMOMECHANICAL STRESSES IN FLIP CHIP BGA USING THE ATC4.2 TEST VEHICLE David W. Peterson  Purchase 
    “FLASHSOLDERING” – A NEW NON-CONTACT SELECTIVE SOLDERING PROCESS FOR SMT COMPONENTS David W. Steinmeier  Purchase 
    NEW GENERATION METALLIC SOLDERABILITY PRESERVATIVES: Donald P. Cullen  Purchase 
    IMPLEMENTING LEAD FREE SOLDDERING - EUROPEAN CONSORTIUM RESEARCH Dr. Malcolm Warwick  Purchase 
    REVIEW OF WAFER LEVEL CSP DEVELOPMENTS E. Jan Vardaman  Purchase 
    ADVANCED CSP AND FINE PITCH BALL GRID ARRAY ASSEMBLY RELIABILITY Ed Blackshear  Purchase 
    ELEMENTS OF STENCIL DESIGN AND MANUFACTURE Edward Hale  Purchase 
    EVOLVING THE NEW PRODUCT INTRODUCTION PROCESS: AN EMS CASE STUDY Edwin B. Smith, III  Purchase 
    MULTIMEDIA FROM A TRAINER’S PERSPECTIVE Floyd H. Bertagnolli  Purchase 
    DEVELOPMENT AND QUALIFICATION PROCESS FOR 1 MM CCGA TECHNOLOGY IMPLEMENTATION Ganesh Sure  Purchase 
    CURTAILING VOIDS IN FINE PITCH BALL GRID ARRAY SOLDER JOINTS Gary Morrison  Purchase 
    ENVIRONMENTAL ISSUES IN ELECTRONICS ASSEMBLY Greg Munie  Purchase 
    HIGH-SPEED SECOND - LEVEL CSP AND FLIP CHIP ASSEMBLY USING FLIP CHIP SHOOTERS Günter Schiebel  Purchase 
    CSP BOARD LEVEL RELIABILITY - RESULTS H. J. Albrecht  Purchase 
    THE NEW IPC HDI (MICROVIA) DESIGN GUIDELINE (IPC-2315) Happy Holden  Purchase 
    MACHINE AND PROCESS CAPABILITY COEFFICIENT OF SOLDER PASTE PRINTERS Heinz Wohlrabe  Purchase 
    DEVELOPING MULTIMEDIA TRAINING PROGRAMS James C. Blankenhorn  Purchase 
    SOLDER PASTE PRINTING REQUIREMENTS FOR CSP PACKAGES Jeff Kennedy  Purchase 
    SOLDER PASTE INSPECTION FOR SCREEN PRINTING Jeff Woolstenhulme  Purchase 
    SOLDERABILITY OF DIFFERENT BOARD FINISHES UNDER NITROGEN ATMOSPHERES WITH DIFFERENT ROLS Jens Tauchmann  Purchase 
    THE CHANGING NEEDS OF MANUFACTURING SYSTEM DESIGN Jim Kane  Purchase 
    DESIGN, ANALYSIS, AND MEASUREMENT OF A NOVEL PLASTIC BALL GRID ARRAY PACKAGE John Lau  Purchase 
    PCB MANUFACTURING AND TESTING OF THE DIRECT RAMBUS John Lau  Purchase 
    ECONOMICS OF BOARD TESTING & PROCESS COST OPTIMIZATION K. Douglas Werner  Purchase 
    PROCUREMENT LEAD TIME REDUCTION AT A CONTRACT ASSEMBLY FACILITY THROUGH AN INTELLIGENT AGENT BASED FRAMEWORK K. Srihari  Purchase 
    OSPS: ADDRESSING FUTURE SURFACE FINISHING NEEDS Karl Wengenroth  Purchase 
    ENVIRONMENTAL ISSUES IN ELECTRONICS AND THE TRANSITION TO LEAD-FREE SOLDERING Kay Nimmo  Purchase 
    INVESTIGATION OF THE PRINTING PROCESS FOR CSP ASSEMBLING Kazu Nakajima  Purchase 
    THE RELIABILITY IMPROVEMENT OF 0.5MM PITCH T-CSP Kazuaki Ano  Purchase 
    ROOM TEMPERATURE ADHESION IN SILICONE ENCAPSULANTS Kelly J. Wall  Purchase 
    OPTIMIZING PERFORMANCE IN REFLOW SOLDERING WITH DYNAMIC FLOW ENGINEERING Kerem Durdag  Purchase 
    IN-LINE BONDING CAVITY PACKAGING FOR GLOB-TOP REPLACEMENT Kevin Chung  Purchase 
    TRENDS IN ELECTRONIC PRODUCTS AND PLACEMENT EQUIPMENT Kevin Towle  Purchase 
    SOLDERABILITY OF DIFFERENT BOARD FINISHES UNDER NITROGEN ATMOSPHERES WITH DIFFERENT ROLS Klaus Wilke  Purchase 
    FLEXURE INDUCED FAILURE OF BGA SOLDER JOINTS Kuan-Shaur Lei, Jaime LLinas, and Mark Gwaltney  Purchase 
    MANAGING SHOP FLOOR DATA IN PCB MANUFACTURING Kyle Klatka  Purchase 
    COST, BENEFITS AND IMPLEMENTATION OF A SHOP FLOOR LINE MANAGEMENT SYSTEM IN PCB MANUFACTURING Kyle Klatka  Purchase 
    RELIABILITY EXPERIMENTS FOR DIFFERENT MICROVIA CONSTRUCTIONS L. Gopalakrishnan  Purchase 
    PROCESS OPTIMIZATION FOR 1.0 MM PITCH CBGA Marie Cole  Purchase 
    1999 STATUS OF BGA / CSP STANDARDIZATION Mark Bird  Purchase 
    PROCESS CONTROL FOR SOLDER PASTE DEPOSITION Mark Owen  Purchase 
    ANALYSIS AND OPTIMIZATION OF MANUFACTURING AND TEST PROCESS ARRANGEMENTS WITH NEW COST MODELS Martin Oppermann  Purchase 
    CHARACTERIZATION OF FLUX RESIDUES Mary Ann Nailos  Purchase 
    SOLDER JOINT STUDY OF CSP FOR USE DURING THE TRANSITION PERIOD TO LEAD FREE PROCESS Masako Watanabe  Purchase 
    VOLUME MANUFACTURING CHALLENGES OF HDI Mason Hu  Purchase 
    DISTRIBUTION SUPPLY CHAIN MANAGEMENT: INCREASE PRODUCTIVITY, DECREASE COSTS WITH EDI AND ERP + APS Mel Smith  Purchase 
    USING THE INTERNET WITH REAL-TIME REFLOW DATA COLLECTION Mike McMonagle  Purchase 
    THE EFFECT OF CONTRACT MANUFACTURING ON OEM FINANCIAL METRICS Milt Gregory  Purchase 
    CSP ASSEMBLY PROCESS ISSUES AND CHALLENGES Nicholas Brathwaite  Purchase 
    SOLDERING TECHNOLOGY FOR AREA ARRAY PACKAGES Ning-Cheng Lee  Purchase 
    BACK END PROCESS DEVELOPMENT FOR WAFER LEVEL CHIP SCALE PACKAGING Pamela Chang  Purchase 
    TRENDS IN MANUFACTURING THAT AFFECT THE SELECTION OF BGA/CSP REWORK EQUIPMENT Patrick McCall  Purchase 
    QUALIFYING THE BGA PROCESS IN AN ELECTRONIC CONTRACT MANUFACTURING COMPANY ON A SMALL BUDGET Paul Sperry  Purchase 
    SOLDER PASTE DEPOSITION FOR BGA AND CSP REWORK Paul Wood  Purchase 
    TBGA RELIABILITY IN TELECOM ENVIRONMENT Pennanen Virpi  Purchase 
    FLIP CHIP ON ORGANIC SUBSTRATES Peter Borgesen  Purchase 
    REFLOW SOLDERING OF THROUGH-HOLE COMPONENTS Phil Zarrow  Purchase 
    HIGH PERFORMANCE BALL GRID ARRAY ASSEMBLIES FOR HIGH TEMPERATURE AND HIGH ALTITUDE APPLICATIONS Puligandla Viswanadham  Purchase 
    PIN-IN-PASTE SOLDER PROCESS DEVELOPMENT Raiyo Aspandiar  Purchase 
    GENERAL ELECTRIC FLOATING PAD TECHNOLOGYTM FOR BGA AND OTHER MISMATCHED CTE INTERFACES Raymond A. Fillion  Purchase 
    CSP ASSEMBLY RELIABILITY: COMMERCIAL AND HARSH ENVIRONMENTS Reza Ghaffarian  Purchase 
    MEASUREMENT AND ANALYSIS OF BGA DEFECTS WITH ADVANCED X-RAY INSPECTION SYSTEMS Richard Amtower  Purchase 
    RAISING THE SPEED LIMIT OF YOUR SMT PROCESS Richard R. Lathrop Jr.  Purchase 
    RELIABILITY ANALYSIS OF FLIP CHIP ON BOARD ASSEMBLIES USING NO-FLOW UNDERFILL MATERIALS Ryan Thorpe  Purchase 
    SIMULTANEOUS LASER SOLDERING FOR SMDS ON 3D-MIDS S. Hierl  Purchase 
    SECOND LEVEL INTERCONNECT RELIABILITY OF REWORKED PACKAGES AND ROUTING EVALUATION FOR HIGH I/O STAGGERED ARRAY BGA PACKAGES Santhana S. Satagopan  Purchase 
    BROADENING THE CERAMIC CSP MARKET FOR HIGHER RELIABILITY APPLICATIONS Shoji Uegaki  Purchase 
    MICROSTRUCTURAL EVOLUTION OF SN-AG SOLDER JOINTS RESULTING FROM SUBSTRATE COPPER DISSOLUTION Srinivas Chada  Purchase 
    STENCIL MANUFACTURE AND ITS EFFECT UPON THE SOLDER PRINTING PROCESS Stanley Dudek  Purchase 
    ENHANCING BOARD LEVEL BGA ASSEMBLY AND RELIABILITY Steven Dunford  Purchase 
    TEST AND INSPECTION AS PART OF PROCESS CONTROL Stig Oresjo  Purchase 
    IMPLICATIONS OF FINE BALL GRID ARRAY DIMENSIONAL VARIATION Syed Sajid Ahmad  Purchase 
    HIGH THERMAL PERFORMANCE TAPE BGA FOR MEDIA PROCESSOR Tatsuya Ohtaka  Purchase 
    CERAMIC SUBSTRATE THICKNESS, TEST BOARD THICKNESS, AND PART SPACING: A SCREENING DOE Thomas Koschmieder  Purchase 
    PRINTED WIRING BOARD FABRICATORS - ARE THEY EQUALLY CAPABLE? Timothy A. Estes  Purchase 
    CHIP SCALE PACKAGE SOLDER PASTE STENCIL PRINTING OPTIMIZATION Tom Long  Purchase 
    CHOOSING AND IMPLEMENTING A FULLY INTEGRATED ON-LINE QUALITY SYSTEM Tom Lyons  Purchase 
    CONTINUOUS IMPROVEMENT APPROACHES FOR WAVE SOLDERING PROCESS Tony Huang  Purchase 
    MULTI CHIP POWER PACKAGING - RELIABILITY ASSESSMENT Torsten Hauck  Purchase 
    RELIABILITY ASSESSMENT OF A THIN (FLEX) BGA USING A POLYIMIDE TAPE SUBSTRATE Trent Thompson  Purchase 
    BURIED COMPONENTS IN PRINTED WIRING BOARDS Wallace D. Doeling  Purchase 
    IDENTIFYING THE CHEMICALS RESPONSIBLE FOR CONDUCTIVE ANODIC FILAMENT (CAF) ENHANCEMENT Westin R. Bent  Purchase 
    STENCIL DESIGN FOR MIXED TECHNOLOGY THROUGH-HOLE / SMT PLACEMENT AND REFLOW William E. Coleman  Purchase 
    CSP DESIGN AND RELIABILITY: LEAD DESIGN GUIDE FOR CENTER PAD BGA® PACKAGE Young Kim  Purchase 
    RELIABILITY OF PBGA ASSEMBLIES UNDER VIBRATION Z.P. Wang  Purchase 
    INTERCONNECT DESIGN AND RELIABILITY OF LAND GRID ARRAY CSPS Z.P.Wang  Purchase 
    A FAILURE ANALYSIS AND REWORK METHOD OF ELECTRONIC ASSEMBLY ON ELECTROLESS NI / IMMERSION AU SURFACE FINISH Zequn Mei  Purchase 

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