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Abstract: The challenge of inspecting densely populated surface mount printed circuit cards in today’s production environment is no small task. Manufacturing has typically relied on a combination of manual inspection and electrical testing to accomplish this task. Due to the continued miniaturization of both components and printed circuit boards, these options are becoming less viable. A detailed technical evaluation was conducted to determine the feasibility of utilizing Automated Optical Inspection (AOI) techniques to inspect double-sided densely populated printed circuit card assemblies after the surface mount reflow process. Key parameters considered were: typical fault spectrum, repeatability, throughput, and overall effectiveness of an automated system.
Keywords: AOI, Automated Optical Inspection, PCBA fault spectrum, PCBA process yields
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