Journal of SMT Article
COMPONENT RELIABILITY ON METAL-BACKED SUBSTRATES FOR HARSH AUTOMOTIVE ENVIRONMENTS
Company: Auburn University
Date Published: 10/1/2004 Volume: 17-4
While there are many issues which must be addressed before metal-backed laminate substrates are deployed into automotive applications, this paper primarily focuses on the impact on component reliability for these applications. The focus of the research within this study is threefold: to determine overall component reliability using metal-backed laminate substrates, to investigate the impact of these substrates on the reflow process, and to study the impact of an alternate plating (ENIG) on component reliability. The results of this research will aid automotive companies in designing more robust controller modules for future vehicle generations.
Key words: component reliability, metal-backed substrates, harsh environment electronics.
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