Journal of SMT Article
IMPLANTABLE MEDICAL ELECTRONICS ASSEMBLY QUALITY AND RELIABILITY CONSIDERATIONS
Company: Universal / SUNY Binghamton
Date Published: 7/1/2004 Volume: 17-3
In this paper we discuss long term degradation phenomena active in solder based assemblies at body temperature, such as Kirkendall voiding and the growth of various intermetallics and whiskers. Depending on materials selection, supplier process control, and contamination, these may lead to significant reductions in the resistance to mechanical loads common in service, or possibly even to failure in the absence of a significant load. Underfilling may reduce and/or eliminate the risk of most such failures, but it introduces alternate risks which must be minimized by optimized materials selection and substrate design.
Key words: packaging, reliability, pacemaker, medical implant.
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