This paper presents the results of solder joint reliability evaluation of VFBGA (very fine pitch ball grid array) and SCSP (stacked chip scale package) Pb-free packages attached to printed circuit boards (PCBs) with eutectic Pb-Sn pastes. The packages were assembled under various reflow profiles using standard Pb-Sn assembly conditions. Peak reflow temperatures of 208°C and 222°C with a soak profile or a direct ramp up profile was used. The assemblies were subjected then to board level temperature cycling (-40°C to 125°C, 30 minutes per cycle) and drop testing. Detailed failure analysis is also presented.

Key words: solder joints, reliability, BGAs, Pb-free, Pb-Sn and Sn-Ag-Cu solder compatibility.">

Journal of SMT Article

SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE

Author: Fay Hua et al.
Company: Intel Corporation
Date Published: 1/1/2003   Volume: 16-1

Abstract: In transition to Pb-free electronics, component suppliers may need to carry dual- line production of Pb-free and Pb-containing components. This could cause extensive logistic problems in manufacturing. A total conversion to Pb-free components could be a solution for this problem. Therefore, solder joint reliability of Sn-Ag-Cu BGA components attached with eutectic Pb-Sn solder paste needs to be addressed.

This paper presents the results of solder joint reliability evaluation of VFBGA (very fine pitch ball grid array) and SCSP (stacked chip scale package) Pb-free packages attached to printed circuit boards (PCBs) with eutectic Pb-Sn pastes. The packages were assembled under various reflow profiles using standard Pb-Sn assembly conditions. Peak reflow temperatures of 208°C and 222°C with a soak profile or a direct ramp up profile was used. The assemblies were subjected then to board level temperature cycling (-40°C to 125°C, 30 minutes per cycle) and drop testing. Detailed failure analysis is also presented.

Key words: solder joints, reliability, BGAs, Pb-free, Pb-Sn and Sn-Ag-Cu solder compatibility.



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