Third, a model describing the release mechanism including sheer and adhesion forces is developed and compared to experimental results. Additionally, a real-time visualization technique and a model for solder paste flow into stencil apertures during the squeegee operation are described and results discussed.

Key words: surface mount, fine feature, transfer efficiencies, solder paste, stencil printing.">

Journal of SMT Article

REAL TIME VISUALIZATION AND PREDICTION OF SOLDER PASTE FLOW IN THE CIRCUIT BOARD PRINT OPERATION

Author: Dr. Gerald Pham-Van-Diep et al.
Company: Cookson Electronics
Date Published: 1/1/2003   Volume: 16-1

StenTech

Abstract: Three studies are undertaken to understand the dependence of aperture fill and stencil release on solder paste print definition. The first study focuses on the role of pastes. Seven pastes are compared and ranked by release performance. Second, three stencil-forming techniques are compared. Chemical etch, laser machined and electro-formed stencils from two manufacturers are studied to determine critical design parameters.

Third, a model describing the release mechanism including sheer and adhesion forces is developed and compared to experimental results. Additionally, a real-time visualization technique and a model for solder paste flow into stencil apertures during the squeegee operation are described and results discussed.

Key words: surface mount, fine feature, transfer efficiencies, solder paste, stencil printing.



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