Journal of SMT Article
FATIGUE PROPERTIES OF Sn/3.5Ag/0.7Cu SOLDER JOINTS AND EFFECTS OF Pb-CONTAMINATION
Company: Swedish Inst. for Metals Rsrch
Date Published: 10/1/2002 Volume: 15-4
The requirements for Pb-free solders are, in general, similar to those of leaded solders. They require similar process windows in terms of soldering time and temperature and should result in equally good or better properties. A great number of lead-free alternatives have been studied in the literature from which alloy Sn/3.5Ag/0.7Cu was chosen to be the studied alternative, as this is probably the one most widely used in Europe [1, 2, 3, 4, 5, 6].
The fatigue properties of Sn/3.5Ag/0.7Cu have been investigated in this work with:
Sn/3.5Ag/0.7Cu has fatigue properties during mechanical cycling which are better than those of the best traditional lead containing samples tested previously. It has, however, been shown that a contamination of 2%-5% Pb can be detrimental to the lifetime of Pb-free solders .
Key words: solder joints, Pb-contamination, fatigue.
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