Journal of SMT Article

EFFECTS OF REFLOW PROFILE ON SHEAR STRENGTH OF Sn/4.0Ag/0.5Cu SOLDER SPHERES FOR BALL GRID ARRAY APPLICATIONS

Author: Daryl Santos et al.
Company: SUNY at Binghamton
Date Published: 7/1/2002   Volume: 15-3

Abstract: The reliability of electronics assemblies depends on the reliability of their individual elements and the reliability of the mechanical, thermal, and electrical interfaces or attachments between these elements. This has increased the focus on built-in reliability to insure that products entering the market are robust and meet consumer needs. Sources of variation that affect reliability include material properties, dimensional variations, and process variations.

There is a continued growth in the implementation of area array technologies for high performance semiconductor packaging and high-density applications. Ball grid arrays (BGAs) and chip scale packages (CSPs) are increasingly used as an alternative to fine pitch leaded packages due to lower cost and higher manufacturing yields.

In the past, failure mechanisms for the tin-lead alloy system on BGAs have been extensively studied. Unacceptable solder ball attachment has been reported in many studies, and it has been linked to many factors including the substrate pad surface finish and attachment process. The purpose of this work is to discuss the role that reflow profiles have on this attachment process for lead-free solder spheres.

Key words: Shear strength, surface finish, reflow process, failure modes, Pb-free, area array.



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