Journal of SMT Article

STACKED MULTI-CHIP PACKAGING FOR THE NEXT GENERATION ELECTRONICS

Author: Vern Solberg
Company: Tessera Technologies
Date Published: 4/1/2002   Volume: 15-2

Abstract: To further the goal of reducing product size, many companies developing portable and hand-held electronic products are seeking solutions that will furnish more functionality within each device. Portable or handheld electronics are a natural target. Digital cameras and camcorders, for example, must consider ease of use, lighter weight and performance. Telephones, pagers, personal communicators, palm top computers, industrial and automotive electronics, personal GPS, medical and diagnostic products, are all viable candidates for more efficient device miniaturization. Memory devices are the first commodity type products in the market to adapt CSP in high volume, however, DSP, controllers, CPUs and any number of application-specific IC devices are also prime candidates for multiple die packaging.

The following paper will introduce several alternative multiple-die package solutions utilizing flexible substrates, along with some new and very unique (but widely available) assembly processes and methodologies.

Key words: BGA, mBGA®, chip scale packaging, CSP, ball grid array, fine pitch ball grid array, FBGA, system-in-package, SiP, stacked die.



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