Journal of SMT Article
IC AND MEMS TRENDS AND RELIABILITY
Company: Jet Propulsion Laboratory
Date Published: 4/1/2001 Volume: 14-2
This paper reviews the current status of IC and MEMS packaging technology with emphasis on reliability; compares the norm for IC packaging reliability evaluation and identifies challenges for development of reliability methodologies for MEMS; and lastly proposes the use of COTS MEMS in order to start generating statistically meaningful reliability data as a vehicle for future standardization of reliability test methodology for MEMS packaging.
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