Journal of SMT Article

AIRCRAFT FLIGHT TESTS AND RELIABILITY IMPROVEMENTS OF MEMS PRESSURE SENSOR ASSEMBLY

Author: Dr. Namsoo Kim
Company: Boeing Phantom Works
Date Published: 1/1/2001   Volume: 14-1

Abstract: Many different sensor types are used in aircraft and aerospace applications in general. During the certification period of a commercial airliner, a loads survey is conducted to collect aerodynamic performance data by measuring the pressure on the surface of the wings. To do this, we developed a unique multi-MEMS pressure sensor system targeted for flight test applications. Here we describe test results collected from two aircraft flight tests using this thin profile ‘pressure belt’ multi-sensor assembly. The overall measurement accuracy was close to our targeted 0.1% of full scale, which is 10x better than the currently used technology. Lessons learned from these flight tests and approaches to further improve the pressure belt reliability are also discussed.

Keywords: Micromechanical systems (MEMS), pressure sensor, direct chip attachment (DCA), flip chip, MCM.



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