Journal of SMT Article

Evaluation of Reworkable Edge Bond and Corner Bond Adhesives for BGA Applications

Authors: Fei Xie, Han Wu, Kelley Hodge, Swapan K. Bhattacharya, Daniel F. Baldwin, and Qing Ji
Company: Engent Inc. and H. B. Fuller Company
Date Published: 9/1/2016   Volume: 29-3

Abstract: This paper presents a comparative study of new high performance reworkable edge bond and corner bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies while maintaining reworkablity. Four edge bond and two corner bond materials were studied. Test vehicles were designed for 12mm BGAs. For edge the bond process, establishing an edge bond that maximizes bond area without encapsulating the solder balls is the key toward achieving high reliability. The reliability testing protocol included board level thermal cycling (-40 to 125°C) and random vibration testing. Two edge bond and two corner bond materials showed reliability performance exceeding 2000 air-to-air thermal cycles. Random vibration reliability testing per JESD22-B103 with a peak acceleration of 3G’s, frequency range of 10 to 1000Hz, was conducted on the four edge bond materials using the CTBGA228 test vehicle. The materials tested showed robust performance in random vibration test passing 90 min with a peak acceleration of 3G.

Keywords: 

Reworkable, Edge Bond, Adhesive, BGA, Large Area BGA



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