Journal of SMT Article
PoP Rework - A Case Study
Company: BEST Inc.
Date Published: 1/31/2015 Volume: 28-1
After reviewing the challenges involved in reworking PoP devices, the actual rework process will be documented as per the end user requirements. This paper points out both the successful and unsuccessful techniques for the rework application.
After using the more traditional approach of device removal including chemical and heat softening of the underfill material, a high speed mechanical milling process along with vibration dampening tooling allowed the device to be removed without applying heat to the board. This resulted in no component or pad damage.
Package on package, PoP, PoP rework, X-ray inspection, PoP warpage, RF shield rework, stacked package
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