Journal of SMT Article
Microstructure and Hardness of Bi-containing Solder Alloys After Solidification and Ageing
Company: University of Toronto and Celestica, Inc.
Date Published: 7/1/2014 Volume: 27-3
Samples were aged for 25 and 100 hours at 100°C. Alloy hardness was measured after solidification ageing and quenching using a Rockwell hardness tester (HR15T scale with a 1/16” carbide ball indenter). The microstructures after solidification and after ageing were compared using scanning electron microscopy (SEM). The microstructures undergo significant changes upon ageing. Bi particles become uniformly distributed in the Sn matrix. While the hardness of SAC alloys is reduced after annealing, the hardness of these experimental alloys increases. The hardness gradually increases with increasing Bi content, as well as with increasing Ag content. The effect of solid solution strengthening and precipitation hardening mechanisms on microstructure and properties is discussed.
Bi-containing solder, Ageing, Microstructure, Hardness
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