Journal of SMT Article
Lead-Free Solder Assembly Implementation for a Mid-Range Power Systems Server
Company: IBM Corporation
Date Published: 1/30/2012 Volume: 25-1
This paper will discuss both the logistics and technical challenges required to define and execute the lead-free solder assembly process implementation for a mid-range server. This work shows that some mid-range server applications can transition to full lead-free assembly and is a critical advancement that paves the way to extend lead-free solder assembly processes throughout the server portfolio. The card assemblies targeted in this work were successfully qualified with lead-free assembly from both a yield and reliability perspective. Based on this work, however, technical challenges do remain in developing a lead-free card assembly process for high end server hardware.
lead-free transition, high complexity SMT, RoHS Server exemption
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