Journal of SMT Article

EXPERIMENT-BASED COMPUTATIONAL INVESTIGATION OF THERMOMECHANICAL STRESSES IN FLIP CHIP BGA USING THE ATC4.2 TEST VEHICLE

Author: David W. Peterson
Company: Sandia National Laboratories
Date Published: 1/1/2000   Volume: 13-1

Abstract: Stress measurement test chips were flip chip assembled to organic BGA substrates containing micro-vias and epoxy build-up interconnect layers. Mechanical degradation observed during temperature cycling was correlated to a damage theory developed based on 3D finite element method analysis. Degradation included die cracking, edge delamination and radial fillet cracking.

KEY WORDS flip chip, piezoresistor stress measurement, die stresses



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