Journal of SMT Article
MINIATURE IC PACKAGE INNOVATIONS FOR ADVANCED MEDICAL ELECTRONIC APPLICATIONS
Company: Tessera, Inc.
Date Published: 4/30/2008 Volume: 21-2
In this paper the author focuses on a number of die-size, near die-size and 3D array package methodologies currently available to the product developer. In addition, a truly innovative µPILR™ substrate platform developed within Tessera’s Package Engineering Service Laboratories will be introduced. This unique substrate platform was developed to further enhance IC package miniaturization by providing smaller contact features. Rather than relying on solder ball contacts for package-to-board interface, the µPILR substrate is furnished with smaller diameter solid copper contact features that enable a finer contact pitch array configuration. The smaller contact pitch provides greater potential for increasing I/O density and improving circuit routing efficiency. Although suitable for single, high I/O die applications, the substrate has proved ideal for package-onpackage configurations as well. By vertically configuring individually packaged IC elements with the µPILR process, a very high degree of functionality is achievable within a single, low profile IC package outline.
Key words: BGA, µBGA, CSP, 3D Packaging, Ball Stack Packaging, µZ BGA, µPILR, PoP
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