Journal of SMT Article
SOLDER AS THERMAL INTERFACE MATERIAL FOR HIGH POWER DEVICES
Company: Intel Corporation
Date Published: 1/1/2006 Volume: 19-1
While solders have a higher thermal conductivity than polymer TIMs, other technical criteria also need to be met: 1) Solder TIMs have to fit the package and assembly process temperature hierarchy. 2) TIM joints, in general, need to be very thin over large areas. Therefore, limiting void formation in the solder joints during reflow is a significant challenge. 3) Solders are stiffer than polymer TIMs in general.
In order to minimize the stress level in the package and also meet solder joint reliability requirements, specific mechanical properties are required. 4) There is no back side of die metallization needed for polymer TIM, thus a challenge remains to directly solder onto non-metallized silicon die, or an additional back side metallization will be needed.
This paper summarizes the key technical benefits and challenges of using solder as a thermal interface material for high power devices through solder selection and reliability evaluation.
Key words: solder thermal interface material, thermal materials, flux.
Cost to download:Members: Free! (Log on to receive the member rate)
Not a member yet? Join SMTA today!
Notice: Sharing of articles is prohibited. Downloaded papers must only be stored on a local hard drive and not in a shared repository either internal or external.