Journal of SMT Article
A STUDY ON MOLDING MATERIAL FOR FLEXIBLE FLIP CHIP CONNECTION
Company: Binghamton University
Date Published: 7/1/2005 Volume: 18-3
Finally, the encapsulating, dissolvable substance is removed from the body of the wafer, leaving the chip attached to the board by only the inter-disposed, flexible wires. This research endeavor addressed the development and selection of the most appropriate molding material to hold the wires stable and finally benefit the assembly processes using the basic mold-attach-dissolve approach.
Key words: flexible flip chip connection, area array, footprint, molding material.
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