Journal of SMT Article
SMT GOES FROM MICRO TO NANOSCALE
Company: Georgia Institute of Tech.
Date Published: 7/1/2005 Volume: 18-3
Nano-interconnects provide an opportunity to have the best of both electrical and mechanical properties, in addition to low cost and at-speed test and burn-in benefits not presently available. The electrical performance with nano-interconnect approaches is expected to reach that of bumpless/chip-first interconnection technologies while enabling low-cost reworkability at the same time.
This paper examines current assembly technologies at microscale and the emerging nanoscale interconnect technology that can provide the best electrical and mechanical performance with unlimited I/Os.
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