Surface Mount Technology Association
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    SMTA JOURNAL ARTICLES: 1999 - Present
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    YEAR   VOLUME   TITLE AUTHOR VIEW DOWNLOAD
    2008 21-2 ROHS CONVERSION FOR MEDICAL DEVICES: RISKS, CONSIDERATIONS AND COMPANY IMPACT PLUS SEVERAL BOM ANALYSIS CASE STUDIES Kim Sharpe Abstract Purchase 
    21-2 MINIATURE IC PACKAGE INNOVATIONS FOR ADVANCED MEDICAL ELECTRONIC APPLICATIONS Vern Solberg Abstract Purchase 
    21-2 EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF NICKEL-PALLADIUM-GOLD FINISH WITH Pb-BASED AND Pb-FREE SOLDERS Edwin Lopez, Paul Vianco, Samuel Lucero, and Carly Abstract Purchase 
    21-1 A COMPLIANT AND CREEP RESISTANT SAC-Al(Ni) ALLOY Dr. Benlih Huang, Dr. Hong-Sik Wang, and Dr. Ning- Abstract Purchase 
    21-1 QUALIFICATION OF A LEAD-FREE CARD ASSEMBLY & TEST PROCESS FOR A SERVER COMPLEXITY PCBA Matthew Kelly, et al. Abstract Purchase 
    21-1 CREEP CORROSION ON LEAD-FREE PRINTED CIRCUIT BOARDS IN HIGH SULFUR ENVIRONMENTS Randy Schueller, Ph.D. Abstract Purchase 
    2007 20-4 CHARACTERIZATION OF Sn-Ag-Cu SOLDER UNDER TENSILE AND SHEAR LOADING Mohammad M Hossain1, Tommi Reinikainen2, Puligandl Abstract Purchase 
    20-4 0.4 mm SOLDER BALL PITCH CHIP SCALE PACKAGING AND DROP TEST PERFORMANCE Geun Sik Kim and Dong Sik Kim Abstract Purchase 
    20-4 AN EXPERIMENTAL STUDY OF A COMPONENTS TERMINATION FINISH CONVERSION PROCESS: THE ROBOTIC STRIPPING AND SOLDER DIPPING PROCESS G. Subbarayan and R. Kinyanjui, J. Deutsch and M. Abstract Purchase 
    20-3 ULTRASONIC GOLD TO GOLD FLIP CHIP INTERCONNECT PROCESS USING LOW COST SUBSTRATES Philip Couts and M. Kawahara Abstract Purchase 
    20-3 CONSIDERATIONS IN SELECTING FLUXES FOR LEAD-FREE WAVE SOLDERING Chrys Shea, Sanju Arora, Steve Brown, and Steven W Abstract Purchase 
    20-3 FAILURE MECHANISM OF SAC 305 AND SAC 405 IN HARSH ENVIRONMENTS AND INFLUENCE OF BOARD DEFECTS INCLUDING BLACK PAD Polina Snugovsky, Zohreh Bagheri, Heather McCormic Abstract Purchase 
    20-2 Lead Free Wave Soldering: Process Optimization for Simple to Highly Complex Boards Denis Barbini, Paul Wang, Peter Biocca, Quyen Chu, Abstract Purchase 
    20-2 MIXING METALLURGY: RELIABILITY OF SAC BALLED AREA ARRAY PACKAGES ASSEMBLED USING SnPb SOLDER Heather McCormick, Polina Snugovsky, Zohreh Bagher Abstract Purchase 
    20-2 65nm FCBGA RELIABILITY FOR NEXT GENERATION GAMING DEVICE1* PHASE I-A METHODOLOGY FOR STREAMLINE PRODUCT DESIGN CYCLE AND 2ND SYSTEM LEVEL QUALIFICATION Paul P.E. Wang, Ph.D.1, DongJi Xie, Ph.D4., Michae Abstract Purchase 
    20-1 MECHANICAL TESTING OF SOLDER JOINT ARRAYS VERSUS BULK SOLDER SPECIMENS Robert Darveaux Abstract Purchase 
    20-1 UTILIZATION OF DIE ATTACH ADHESIVES IN WAFER LEVEL ASSEMBLY OF CAVITY PACKAGES FOR IMAGE SENSORS G Humpston and M Nystrom, S Kanagavel, M Previti a Abstract Purchase 
    20-1 JCAA/JG-PP LEAD-FREE SOLDER TESTING FOR HIGH RELIABILITY APPLICATIONS: -55ºC to +125ºC THERMAL CYCLE TESTING David Hillman and Ross Wilcoxon Abstract Purchase 
    2006 19-4 VOIDS IN SOLDER JOINTS Raiyo F. Aspandiar Abstract Purchase 
    19-4 RELIABILITY STUDY AND SOLDER JOINT MICROSTRUCTURE OF VARIOUS SnAgCu CERAMIC BALL GRID ARRAY (CBGA) GEOMETRIES AND ALLOYS Marie Cole, Matthew Kelly, Mario Interrante, Grego Abstract Purchase 
    19-4 AGING EFFECTS ON DYNAMIC BEND TEST PERFORMANCE OF PB-FREE SOLDER JOINTS ON NI/AU FINISH Min Ding and Adriana Porras Abstract Purchase 
    19-3 SURFACE MOUNT MULTILAYER CERAMIC CAPACITORS FOR HIGH VOLTAGE MEDICAL APPLICATIONS J. Bultitude, P. Gormally, J. Rogers, and J. Jiang Abstract Purchase 
    19-3 RELIABILITY ASSESSMENT OF MIXED TECHNOLOGY DRIVEN BY AVAILABILITY OF LEAD FREE COMPONENTS Lucian Kasprzak, Milind Sawant, Gerry Adams, Brian Lewis, Paul N. Houston, Daniel Baldwin, and Mike Nahorniak Abstract Purchase 
    19-3 COMPARISON OF NEAR-EUTECTIC SnPb AND SnAg SOLDER PLATING FOR WLP APPLICATIONS Bioh Kim, Charles Sharbono, Tom Ritzdorf, and Dan Abstract Purchase 
    19-3 EFFECTS OF ACCELERATED STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, Edwin Lopez, R. Wayne Buttry, Alice K Abstract Purchase 
    19-2 INTEGRATION OF ACTIVE AND PASSIVE COMPONENTS USING CHIP IN POLYMER TECHNOLOGY Lars Boettcher, A. Neumann, A. Ostmann and H. Reichl Abstract Purchase 
    19-2 MODEL BASED APPROACHES FOR SELECTING RELIABLE UNDERFILL-FLUX COMBINATIONS FOR FLIP CHIP PACKAGES Satyanarayan Iyer, Nagendra Nagarur and Purushotha Abstract Purchase 
    19-2 A STUDY OF THE FAILURE MECHANISMS IN LEAD-FREE AND EUTECTIC TIN-LEAD SOLDER BUMPS FOR FLIP CHIP ASSEMBLY Julia Y. Zhao, David Mackessy, and John Jackson Abstract Purchase 
    19-2 EFFECT OF AGING ON PULL STRENGTH OF SnPb, SnAgCu, AND MIXED SOLDER JOINTS IN PERIPHERAL SURFACE MOUNT COMPONENTS A. Choubey, D. Menschow, S. Ganesan, M. Pecht Abstract Purchase 
    19-1 SUPPLY CHAIN DATA EXCHANGE FOR MATERIAL DISCLOSURE Mark Myles Abstract Purchase 
    19-1 DEVELOPMENT OF A "SYSTEMS BASED" COMPLIANCE APPROACH TO THE EUROPEAN UNION'S ROHS DIRECTIVE Holly Evans Abstract Purchase 
    19-1 SOLDER AS THERMAL INTERFACE MATERIAL FOR HIGH POWER DEVICES Fay Hua and Carl Deppisch Abstract Purchase 
    19-1 PROCESS AND RELIABILITY ISSUES WITH LEAD-FREE CSP REWORK Arun Gowda et al. Abstract Purchase 
    2005 18-4 RELIABILITY CONSIDERATIONS FOR IMPLANTED MEDICAL ELECTRONICS Anthony Primavera, Ph.D. and Jamie Hoffpauir Abstract Purchase 
    18-4 EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER BOARD FINISHES WITH Pb-BASED AND Pb-FREE SOLDERS Edwin Lopez et al. Abstract Purchase 
    18-4 EFFECT OF DEVIATING FROM THE REFLOW PROCESS WINDOW FOR LEAD-FREE ASSEMBLY Manivannan Sampathkumar et al. Abstract Purchase 
    18-4 GENERAL APPROACH IN REDUCING EMI FOR 3D MICROELECTRONICS SENSORS Alessandro Gandelli et al. Abstract Purchase 
    18-3 SMT GOES FROM MICRO TO NANOSCALE R. Tummala, A. Aggarwal, S. Bansal, and P.M. Raj Abstract Purchase 
    18-3 DESIGN ANALYSIS AND OPTIMIZATION OF WAFER-LEVEL CSP BOARD LEVEL SOLDER JOINT RELIABILITY Tong Yan Tee et al. Abstract Purchase 
    18-3 A STUDY ON MOLDING MATERIAL FOR FLEXIBLE FLIP CHIP CONNECTION S. Lu, T-H. Lin, D. McBride, and F. Andros Abstract Purchase 
    18-3 A RELIABILITY EXAMINATION OF LEAD-FREE QUARTZ CRYSTAL PRODUCTS USING SURFACE MOUNT TECHNOLOGY ENGINEERED FOR HARSH ENVIRONMENTS Todd H. Treichel, CQE Abstract Purchase 
    18-2 NANOTECHNOLOGY AND LOW TEMPERATURE ELECTRONICS ASSEMBLY Alan Rae Abstract Purchase 
    18-2 RELIABILITY ANALYSIS OF SOME CERAMIC LEAD-FREE SOLDER ATTACHMENTS Olli Salmela et al. Abstract Purchase 
    18-2 FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev Abstract Purchase 
    18-2 MANUFACTURING OPTIMIZATION AND RELIABILITY OF LARGE SOLDERED DAUGHTER MODULES FOR HIGH PERFORMANCE COMMUNICATION APPLICATIONS R. Scott Priore, S. Camerlo, and Mark V. Brillhart Abstract Purchase 
    18-1 OPTIMIZING STENCIL DESIGN FOR LEAD-FREE SMT PROCESSING Chrys Shea and Ranjit S Pandher Abstract Purchase 
    18-1 HOT AIR LEAD-FREE REWORK OF BGA PACKAGES & SOCKETS Alan Donaldson and Raiyo Aspandiar Abstract Purchase 
    18-1 DEVELOPMENT OF 3D-REDISTRIBUTION AND BALLING TECHNOLOGIES FOR FABRICATION OF VERTICAL POWER DEVICES Lars Boettcher et al. Abstract Purchase 
    18-1 DETECTING AND ANALYZING WAFER BUMP VOIDS WITH X-RAY INSPECTION Dr. Udo E. Frank Abstract Purchase 
    2004 17-4 YIELD ENHANCEMENT AND YIELD MODELING FOR MASS REFLOW PROCESS OF 0201 COMPONENTS Susan Lu, Sarah Lam, and Wei-Yun Cheng Abstract Purchase 
    17-4 LEAD-FREE SOLDERING FOR SMT COMPONENTS: A REVIEW OF PROCESSING AND RELIABILITY ISSUES Frank Liotine, Jr., PE Abstract Purchase 
    17-4 COMPONENT RELIABILITY ON METAL-BACKED SUBSTRATES FOR HARSH AUTOMOTIVE ENVIRONMENTS John L. Evans et al. Abstract Purchase 
    17-3 TRENDS IN MEDICAL DEVICE DESIGN AND MANUFACTURING Phil Salditt Abstract Purchase 
    17-3 IMPLANTABLE MEDICAL ELECTRONICS ASSEMBLY QUALITY AND RELIABILITY CONSIDERATIONS Peter Borgesen / Eric Cotts Abstract Purchase 
    17-3 IMPACT OF ADVANCES IN COMPONENT PACKAGING ON MEDICAL DEVICES James Marshall et al. Abstract Purchase 
    17-3 IMPROVING MANUFACTURABILITY, REDUCING COST, AND EXTENDING PRODUCT LIFE - PROCESSES AND PITFALLS UNIQUE TO MEDICAL DEVICES Chris Rozewski and Walter Thomson Abstract Purchase 
    17-2 EVALUATION OF THE EFFECTS OF PROCESSING CONDITIONS ON SHEAR STRENGTH AND MICROSTRUCTURE IN PB-FREE SURFACE MOUNT ASSEMBLY S. Bukhari, D.L. Santos, L.P. Lehman and E. Cotts Abstract Purchase 
    17-2 COMPREHENSIVE NUMERICAL AND EXPERIMENTAL ANALYSIS OF MATRIX TFBGA WARPAGE Tong Yan Tee et al. Abstract Purchase 
    17-2 IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal and Hugh Roberts et al. Abstract Purchase 
    17-2 ELECTROCHEMICAL MIGRATION ON HASL PLATED FR-4 PRINTED CIRCUIT BOARDS Elissa Bumiller et al. Abstract Purchase 
    17-2 TERNARY INTERMETALLIC COMPOUND - A REAL THREAT TO BGA SOLDER JOINT RELIABILITY Shelgon Yee, Ph. D., et al. Abstract Purchase 
    17-1 A COMPARISON BETWEEN POWER AND THERMAL CYCLING FOR A FC PBGA Andrew Mawer, D. Hodges Popps, and G. Presas Abstract Purchase 
    17-1 MANUFACTURING AND RELIABILITY OF PB-FREE AND MIXED SYSTEM ASSEMBLIES (SNPB/PB-FREE) IN AVIONICS ENVIRONMENTS Dave Nelson and Hector Pallavicini et al. Abstract Purchase 
    17-1 EVALUATING THE EFFECT OF SOLDER PASTE RESIDUES ON RF SIGNALS BETWEEN 5 AND 10 GHZ Dwayne R. Shirley et al. Abstract Purchase 
    17-1 LEAD-FREE CARD ASSEMBLY AND REWORK FOR COLUMN GRID ARRAYS Marie Cole et al. Abstract Purchase 
    17-1 ASSEMBLY ISSUES WITH MICROVIA TECHNOLOGIES Harjinder Ladhar and Sundar Sethuraman Abstract Purchase 
    2003 16-4 AN OVERVIEW OF IPC STANDARDS RELATED TO MOISTURE SENSITIVE COMPONENTS Robert Rowland Abstract Purchase 
    16-4 MOISTURE SENSITIVE COMPONENT STORAGE Hiro Suganuma and Alvin Tamanaha Abstract Purchase 
    16-4 THE IMPACT OF LEAD-FREE REFLOW TEMPERATURES ON THE MOISTURE SENSITIVITY PERFORMANCE OF PLASTIC SURFACE MOUNT PACKAGES B.T. Vaccaro, R.L. Shook, and D.L. Gerlach Abstract Purchase 
    16-4 CASE STUDIES IN THE EVALUATION OF MOISTURE SENSITIVITY LEVEL AND RELIABILITY OF DEVICES FOR HIGH-REL APPLICATIONS S. R. Martell Abstract Purchase 
    16-3 FAILURE MODE AND EFFECTS ANALYSIS IN ELECTRONICS MANUFACTURING Jayang Patel et al. Abstract Purchase 
    16-3 AN INVESTIGATION ON THE RELIABILITY OF CSP SOLDER JOINTS WITH NUMEROUS UNDERFILL MATERIALS Sunny Zhang et al. Abstract Purchase 
    16-3 DROP TEST AND IMPACT LIFE PREDICTION MODEL FOR QFN PACKAGES Tong Yan Tee et al. Abstract Purchase 
    16-3 OPTICAL CONNECTOR CONTAMINATION/SCRATCHES AND ITS INFLUENCE ON OPTICAL SIGNAL PERFORMANCE Tatiana Berdinskikh et al. Abstract Purchase 
    16-2 FLUX-LESS / VOID-FREE: AN ENVIRONMENT-FRIENDLY SOLDERING PROCESS FOR OPTOELECTRONICS ASSEMBLIES Gary Pangelina Abstract Purchase 
    16-2 NANO-OPTICS: NEW OPTICAL STRUCTURES AND LITHOGRAPHY ENABLE STANDARDIZED MANUFACTURING FOR MULTIPLE COMPONENTS Barry J. Weinbaum and Hubert Kostal Abstract Purchase 
    16-2 AUTOMATED PACKAGING OF MEMS DEVICES Joseph S. Bell Abstract Purchase 
    16-2 SURFACE MOUNT OPTICS A NEW APPROACH TO PHOTONIC ASSEMBLY Dr. Steven K. Case Abstract Purchase 
    16-1 ACOUSTIC MICRO IMAGING IN THE FOURIER DOMAIN FOR EVALUATION OF ADVANCED PACKAGING Janet E. Semmens and Lawrence W. Kessler Abstract Purchase 
    16-1 REAL TIME VISUALIZATION AND PREDICTION OF SOLDER PASTE FLOW IN THE CIRCUIT BOARD PRINT OPERATION Dr. Gerald Pham-Van-Diep et al. Abstract Purchase 
    16-1 A NEW DIMENSION IN STENCIL PRINT OPTIMIZATION Ian Fleck and Prashant Chouta* Abstract Purchase 
    16-1 SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Fay Hua et al. Abstract Purchase 
    2002 15-4 IMPACT OF COMPONENT TERMINAL FINISH ON THE RELIABILITY OF Pb-FREE SOLDER JOINTS Gregory Henshall et al. Abstract Purchase 
    15-4 EFFECT OF COPPER CONCENTRATION ON THE SOLID-STATE AGING REACTIONS BETWEEN TIN-COPPER LEAD-FREE SOLDERS AND NICKEL W. T. Chen, R. Y. Tsai, Y. L. Lin, and C. R. Kao Abstract Purchase 
    15-4 COMPONENT TEMPERATURE STUDY ON TIN-LEAD AND LEAD-FREE ASSEMBLIES Matthew Kelly et al. Abstract Purchase 
    15-4 FATIGUE PROPERTIES OF Sn/3.5Ag/0.7Cu SOLDER JOINTS AND EFFECTS OF Pb-CONTAMINATION J. Oliver, M. Nylén, O. Rod, C. Markou Abstract Purchase 
    15-3 CASE STUDY: THE EFFECT OF SEVERE BLACK PAD DEFECT ON SOLDER BONDS ON BALL GRID ARRAY COMPONENTS Jodi Roepsch, Robert Champaign, Marlin Downey Abstract Purchase 
    15-3 EFFECTS OF REFLOW PROFILE ON SHEAR STRENGTH OF Sn/4.0Ag/0.5Cu SOLDER SPHERES FOR BALL GRID ARRAY APPLICATIONS Daryl Santos et al. Abstract Purchase