Technical Sessions

Wednesday, May 15, 2013 | 8:00am - 5:00pm

Thursday, May 16, 2013 | 8:00am - 5:30pm

Friday, May 17, 2013 | 8:00am - 12:00pm
Wednesday, May 15, 2013


 8:00am

Registration/Continental Breakfast



8:50am

Opening Remarks



9:00am

Keynote: Solder Assembly Solutions for 3D IC Packaging

Charles G. Woychik, Ph.D. Charles G. Woychik, Ph.D., Invensas Corporation
3D IC packaging is transitioning from the lab to commercial adoption. The arrival of the first commercial 2.5D (silicon interposer) product challenges us to question "which parts of the process and supply chain are maturing, and which parts are ripe for reinvention" Invensas has been developing HVM fine-node 2.5D interposer technology in partnership with AllVia, in conjunction with advanced micro-bumped die that accommodate interconnect schemes exceeding 10,000 I/O. Modeling of the assembly process has been used to evaluate different process flows in order to develop a high yielding, and reliable 3D package design. An overview will be given of this development activity, as well as a brief discussion of the remaining "choke-points", those areas in need of reengineering and reinvention.

9:45am

Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump

JaePil Jung, Ph.D., University of Seoul

10:15am

Microalloyed Sn-Cu Pb-free Solder for High Temperature Applications

Keith Howell, Nihon Superior

10:45am

Break



11:15am

Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 1 - AXI Capability for HoP Detection

Alex Chan, Alcatel-Lucent

11:45am

Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 2- Warpage Acceptance Proposal

Alex Chan, Alcatel-Lucent

12:15pm

Lunch



1:30pm

SERDP Tin Whisker Testing and Modeling: High Temperature/High Humidity Conditions

Stephan Meschter, BAE International

2:00pm

The Elimination of Whiskers From Electroplated Tin

George Milad, Uyemura International

2:30pm

Characterization of Hybrid Conformal Coatings Used for Mitigating Tin Whisker Growth,

Junghyun Cho, Ph.D., State University of New York – Binghamton

3:00pm

Break



3:30pm

Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys

Eva Kosiba, Celestica, Inc.

4:00pm

Development of a Suitable Flux Medium for Cleanable and No-Clean Solder Pastes Based on Tin-Bismuth-Silver Alloy

Emmanuelle Guene, P.E., Inventec

4:30pm

Fracture of Lead-free Solder Joints as a Function of Strain Rate, Local End Geometry and Thickness

Amir Nourani, University of Toronto

5:00pm

Session Ends





Thursday, May 16, 2013


 8:00am

Registration/Continental Breakfast



8:50am

Opening Remarks



9:00am

Less is More – Vapor Phase - Quality Improvement Under Oxidation Free Soldering Conditions

Claus Zabel, ASSCON Systemtechnik Elektronik GmbH

9:30am

Void-Free Soldering With A New Vapor Phase Vacuum Technology

J. B. Byers, A-Tek LLC

10:00am

Break



11:00am

Factors Affecting Stencil Aperture Design for Next Generation Ultra Fine Pitch Printing

Jeff Schake, DEK Printing Machines, Ltd.

11:30am

The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings

Harald Grumm, Christian Koenen GMB

12:00pm

Stencil Printing Yield Improvements

Debbie Carboni, Kyzen Corporation

12:30pm

Lunch



1:30pm

Statistical Methods for Discriminating Between Tin-Lead and Lead-free Solder Interconnect Failure Data in High Cycle Fatigue

Joseph M. Juarez, Ph.D., Honeywell International

2:00pm

NASA DoD Phase 2: SAC 305 and SN100C Copper Dissolution Testing

Dave Hillman, Rockwell Collins

2:30pm

Process Control and Reliability of Reworked BGA Solder Joint

Adrian Hirceaga, Creation Technologies

3:00pm

Break



3:30pm

Jetting Solder Paste Opens Up New Possibilities in Your SMT Production

Nico Coenen, MYDATA

4:30pm

Converting Cable Assembly Manufacturing to Lead Free Solder

Matt Kelly, P.Eng., MBA, IBM Corporation

5:00pm

Material Selection and Parameter Optimization for Reliable TMV PoP Assembly

Martin Anselm, Ph.D., Universal Instruments Corporation

5:30pm

Session Ends





Friday, May 17, 2013


 8:00am

Registration/Continental Breakfast



8:50am

Opening Remarks



9:00am

Reliability Challenges for Bottom Termination Components

Brook Sandy-Smith, Indium Corporation

9:30am

Generalizations about Component Flatness at Elevated Temperature

Bev Christian, Ph.D., Blackberry

10:00am

Dielectric Material Damage vs. Conductive Anodic Filament Formation

Paul Reid, PWB Interconnect Solutions

10:30am

Break



10:45am

The Study of Corrosion Behavior of Cu in Sixteen Commercial Beverages by Chemical and Electrochemical Measurement

Nancy Wang, Blackberry

11:15am

Electronic Grade Coating for Protection of Electronic Components

Wei Xing Hou, Ph.D., 3M Canada

11:45am

Final Comments







Copyright © 2013 SMTA, All rights reserved.
Reproduction in whole or in part without permission is prohibited.
SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819