The Charles Hutchins Educational Grant, co-sponsored by the SMTA and
Circuits Assembly magazine, was established in memory of past SMTA president and industry colleague Dr. Charles Hutchins.
Chapter Challenge The SMTA recently announced that for 2008 they will match "dollar for dollar" each donation made by a chapter (up to $1,000 per chapter) to the Hutchins Grant.
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The $5000 grant is awarded annually to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field.
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The 2007 recipient, Gayatri Cuddalorepatta, a graduate student in the field of mechanical engineering at the University of Maryland, has been selected by the SMTA Grant Committee for her project entitled "Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach."
Recently her research projects have focused on the in-depth understanding needed to permit the electronics industry to comply with world-wide legislation that requires them to eliminate lead from their electronic hardware. Her project includes experimental studies as well as fundamental mechanics-based modeling to quantify the behavior of various candidate materials for Pb-free solders. Cuddalorepatta has a B.E. in Mechanical Engineering from Osmania University (India), and an M.S. in Mechanical Engineering from State University of New York, Binghamton.
In her professional pursuits, Cuddalorepatta hopes to work in the field of electronics packaging. She plans to join the academic world to catalyze studies in nano-scale material modeling and experimental techniques applied to diverse material systems in electronic packaging. She has particular interest in involving research teams from multiple disciplines to address issues faced in practical applications involving electronic packages and systems to develop more efficient and robust electronic packages.
The award is presented annually at the SMTA Annual Meeting during the SMTA International Conference.
PAST RECIPIENTS:
2006
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Sungchul Joo
Georgia Institute
of Technology
(Atlanta, GA)
"Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Approach Using Nano-Particle Metal"
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2005
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Leila Janessari Ladani
University of Maryland
(College Park, MD)
"Effect of Voids Caused By Manufacturing Variation on the Thermo-mechanical Durability of Sn3.8Ag0.7Cu Solders"
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2004
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Brian McAdams
Lehigh University
(Bethlehem, PA)
"Sub-critical Initiation of Delaminations at the Underfill/ Passivation Interface in Flip-chip Assemblies"
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2003
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Andrew Perkins
Georgia Institute
of Technology
(Atlanta, GA)
"Investigating the Combination of High and Low Cycle Fatigue on Solder Joints"
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2002
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Arun Gowda
Binghamton University
(Binghamton, NY)
"High I/O Area Array Devices and Stacked CSPs-Issues in Assembly and Reliability"
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2001
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Renzhe Zhao
Auburn University
(Auburn, AL)
"Wafer Applied Reworkable Fluxing Underfill for Direct Chip Attach"
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2000
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Jennifer Venton
Georgia Institute
of Technology
(Atlanta, GA)
"Flip Chip on Flex for Low Cost Electronic Packaging"
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1999
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Anita Sargent
Binghamton University
(Binghamton, NY)
"The Mechanism of Electroless Gold Plating Using Dimethylamineborane Baths for Electronic Packaging Applications"
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1998
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Daniel Lewis
Lehigh University
(Bethlehem, PA)
"Solidification of Ternary Alloys"
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HUTCHINS GRANT COMMITTEE
Tom Borkes, The Jefferson Project
Marie S. Cole, IBM Microelectronics
Tim Ginzburg, Celestica Inc.
Glen Herzog, Fairfield Industries
R. Wayne Johnson, Ph.D., Auburn University
Jason Keeping, P.Eng., Celestica Inc.
Robert Kinyanjui, Ph.D, Sanmina-SCI Corp.
Steven Lustig, LSI Corporation
Randy D. Schueller, Ph.D., Dell Inc.
Steve Stach, Austin American Technology Corp.
Laura J. Turbini, Ph.D., Research in Motion
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