The Charles Hutchins Educational Grant, co-sponsored by the SMTA and
Circuits Assembly magazine, was established in memory of past SMTA president, educator, mentor, and industry colleague, Dr. Charles Hutchins.
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The $5000 grant has been presented annually since 1998 to a full time graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field.
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The Application Deadline has passed. Next year's Application Form and Eligibility Requirements will be available early in 2014!
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The 2012 recipient, Xian Qin, a graduate student at Georgia Institute of Technology, has been selected by the SMTA Grant Committee for her project entitled "Highly Reliable Low CTE Interposer to Printed Wiring Board SMT Interconnections."
Xian will receive her Ph.D. in 2015 from Georgia Institute of Technology and received her Bachelor of Engineering from Tsinghua University in 2010.
The award was presented at the SMTA Annual Meeting during the SMTA International Conference in Orlando, FL, October 14-18, 2012. The 2013 grant will be presented at SMTAI in Fort Worth, TX, October 13-17, 2013.
PAST RECIPIENTS:
2011
Pylin Sarobol, Purdue University (West Lafayette, IN)
Paper: "Growth Mechanisms for the Formation of Tin Whiskers"
Where is she now? Completing her program at Purdue University
2010
Jonathon Tucker, Purdue University (West Lafayette, IN)
Paper: "Effects of Alloy Composition and Low Current Density Electromigration on Deformation Behavior of Pb-Free Solders"
Where is he now? Completing his program at Purdue University
2009
Zhaozhi Li (George), Auburn University (Auburn, AL)
Paper: "Design, Processing and Reliability Characterizations of 3D Wafer Level Chip Scale Packaging Technology"
Where is he now? Senior Process Engineer, Intel ATTD
2008
Lei Nie, CALCE @ University of Maryland (College Park, MD)
Paper: "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process"
Where is she now? Process Engineer, Intel Corporation
2007
Gayatri Cuddalorepatta, University of Maryland (College Park, MD)
Paper: "Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach"
Where is she now? Continuing her graduate studies
2006
Sungchul Joo, Georgia Institute of Technology (Atlanta, GA)
Paper: "Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Approach Using Nano-Particle Metal"
Where is he now? Continuing his graduate studies
2005
Leila Janessari Ladani, Ph.D., University of Maryland (College Park, MD)
Paper: "Effect of Voids Caused By Manufacturing Variation on the Thermo-mechanical Durability of Sn3.8Ag0.7Cu Solders"
Where is she now? Assistant Professor, Utah State University
2004
Brian McAdams, Ph.D., Lehigh University (Bethlehem, PA)
Paper: "Sub-critical Initiation of Delaminations at the Underfill/ Passivation Interface in Flip-chip Assemblies"
Where is he now? Manager Global Products, W.L. Gore
2003
Andrew Perkins, Ph.D., Georgia Institute of Technology (Atlanta, GA)
Paper: "Investigating the Combination of High and Low Cycle Fatigue on Solder Joints"
Where is he now? R&D Process Engineer, Aptina Imaging
2002
Arun Gowda, Ph.D., Binghamton University (Binghamton, NY)
Paper: "High I/O Area Array Devices and Stacked CSPs-Issues in Assembly and Reliability"
Where is he now? Electronic Packaging Engineer, GE Global Research
2001
Renzhe Zhao, Ph.D., Auburn University (Auburn, AL)
Paper: "Wafer Applied Reworkable Fluxing Underfill for Direct Chip Attach"
Where is he now? Technical Manager, Henkel Technologies
2000
Jennifer Venton Muncy, Ph.D., Georgia Institute of Technology (Atlanta, GA)
Paper: "Flip Chip on Flex for Low Cost Electronic Packaging"
Where is she now? Packaging Quality Assurance, IBM Microelectronics
1999
Anita Sargent, Binghamton University (Binghamton, NY)
Paper: "The Mechanism of Electroless Gold Plating Using Dimethylamineborane Baths for Electronic Packaging Applications"
Where is she now? OB/GYN Resident at Yale Medical Center
1998
Daniel Lewis, Ph.D., Lehigh University (Bethlehem, PA)
Paper: "Solidification of Ternary Alloys"
Where is he now? Professor Rensselaer Polytechnic Institute
HUTCHINS GRANT COMMITTEE
Laura J. Turbini, Ph.D., Chair, International Reliability Consultant
Scott J. Anson, Ph.D., P. Eng., Rochester Institute of Technology
Tom Borkes, The Jefferson Project
Bankeem Chheda, Epic Technologies, LLC
Marie S. Cole, IBM Corporation
R. Wayne Johnson, Ph.D., Tennessee Tech University
Jason Keeping, P. Eng., Celestica Inc. (Canada)
Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
Steven Lustig, The Coca Cola Company
Luu T. Nguyen, Ph.D., Texas Instruments Inc.
Andrew Perkins, Ph.D., Aptina Imaging
(2003 Hutchins Grant Recipient)
Randy D. Schueller, Ph.D., DfR Solutions Inc.
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