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SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Jul 12 & 14, 2016 Webtorial: How to Design for Testability (DFT) for Today's Boards and Systems

Aug 23 & 25, 2016 Webtorial: Stencil Printing-Advanced Topics

Sep 13, 2016 Webinar: Practical Guidelines in Handling Moisture Sensitivity of SMT Packages

Nov 3, 2016 Webinar: The Three Fundamentals to the Ultimate Reliability in Consumer Electronics

Nov 8 & 15, 2016 Webtorial: Robotic Iron and Laser Soldering for Lead-Free and High Temperature Alloys

Looking for a past webinar? Check the knowledge base.

Webinar vs Webtorial: What's the Difference?


  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*


  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Ryan Flaherty, 952-920-7682.

    If you are interested in presenting a webinar or webtorial, contact Jenny Ng, 952-920-7682 or submit your abstract here.

    SMTA Webtorial:
    How to Design for Testability (DFT) for Today's Boards and Systems
    Two (2) 90 minute Sessions
    Tuesday, July 12 and Thursday, July 14, 2016

    1:00-2:30pm Eastern
    Presented by: Louis Y. Ungar, President, A.T.E. Solutions, Inc.

    Detailed review of the various guidelines covered in the SMTA/TMAG Testability Guidelines. Part 1 of the Webtorial will introduce attendees to the issues surrounding testing of electronic circuit boards and systems. It introduces testing concept and the mix of testers normally used. This includes the JTAG/IEEE-1149.1 boundary scan as well as built-in self test (BIST). With a combination of these technologies, the idea of non-intrusive board (and system) test is explored. The Webtorial takes the view that DFT is the best way to improve test performance and cost effectiveness. Towards that end Part 2 provides specific DFT guidelines. It concludes with exploring new standards and developments in DFT that will improve testing of boards and systems in the future.

    Part 1 (July 12) - Understanding Test, Test Strategies

  • What’s in today’s IC?
  • Today’s (and Tomorrow’s) Boards and Systems
  • Testing Philosophy and Economics
       - Conceptual Design and Failure Mode Effects Analysis    - Board/System Test Economics
  • Design for Testability: What, Why, How, Who and most importantly When?

    The Test Mix
  • Design Verification Tests
       o Functional Simulations
       - Signal Integrity
       - Margining and Robustness
  • Environmental Stress Screening, HALT, HASS, Burn-In
  • Qualification and Acceptance Testing
  • Automated Inspections
       - Optical Inspection (AOI)
       - X-Ray Inspection (AXI)
       - Thermal Characterization
  • Connectivity Testing
  • Manufacturing Defects Analysis (MDA)
  • In-Circuit Testing
       - Bed-of-Nails Access
       - Flying Probe Test
  • Boundary-Scan (JTAG/IEEE-1149.x)
  • Functional Board Testing
  • Built-In Self Test (BIST)
  • System Level Test and Diagnoses
  • Field Support Testing

    Strategies Towards "Non-Intrusive Board Test"
  • Traditional In-Circuit followed by Functional Board Test
  • Injecting Boundary Scan and BIST into the Traditional Approach
  • Testing to parallel design – a new paradigm

    Part 2 (July 14) – Implementing Design for Testability

    Detailed review of the various guidelines covered in the SMTA/TMAG Testability Guidelines.

  • Probing and Fixturing Guidelines
  • Flying Probe Guidelines
  • Vectorless Testing Guidelines
  • AOI Inspectability Guidelines
  • X-Ray Inspection Guidelines
  • Electrical Design Guidelines
  • Boundary Scan Guidelines
  • Analog and Mixed Signal Guidelines
  • Built-In Self Test Guidelines
  • Diagnoses and Support Guidelines

    The Future of DFT
  • How DFT makes sense… and dollars:
  • IEEE 1687 and Hierarchical Test
  • System JTAG (SJTAG)
  • Design for eXcellence (DFX)
  • Let's learn from the IC world: DFT to Scan to Compression to BIST to BISR (Built-In Self Repair)

    Who Should Attend:
    DFT is a design discipline that benefits test engineering, manufacturing, logistics, field support and even Marketing. A major benefit of DFT is earlier time to market, and that is a major concern of all managers. Anyone who can influence or be influenced by DFT will find this Webtorial beneficial.

    Instructor Bio
    Louis Y. Ungar enjoys a well-known reputation in the electronics testing profession. He has built, programmed, and selected Automatic Test Equipment (ATE) for a large number of clients both in the commercial and military community. Having introduced the first university course on Automatic Testing and Design for Testability at UCLA, he and his company have taught similar courses to thousands around the world in publicly held forums, at company facilities and online. He has served on international standards committees, such as the IEEE. He led the Surface Mount Technology Association (SMTA) Testability Committee to publish the SMTA Testability Guidelines in 2002 and helped in the project to revise it several times since. He has helped develop an economic modeling tool, called The Test Flow Simulator and a testability management tool, called The Testability Director.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    Stencil Printing-Advanced Topics
    Two (2) 90 minute Sessions
    Tuesday, August 23, 2016 and Thursday, August 25, 2016

    1:00-2:30pm Eastern
    Presented by: Chrys Shea Shea Engineering Services

    Chrys Shea

    Session 1, August 23, 2016
    This advanced course on SMT solder paste stencil printing builds upon the basics to give the attendees a larger toolkit for troubleshooting and process improvement. The session starts with handling incoming stencils, and the need to clean and verify them before putting them into production. A simple stencil verification method using SPI is described in detail, as is the inclusion of test coupons to aid in troubleshooting stencil quality issues.

    The session continues with detailed methods of troubleshooting suspected stencil issues, showing images and data from several real-world stencil trials. It discusses the impact of aperture size and thickness variation, aperture location, and wall cut quality.

    Stencil underwiping is presented, reviewing types of wipe sequences, wiper papers, and solvents, particularly as they relate to modern lead-free solder pastes and the preservation of nanocoatings. Videos and ultraviolet images of the effects of cleaning and nanocoatings are shown.

    Session 2, August 25, 2016
    Automated Solder Paste Inspection (SPI) is almost as important as the print process itself. SPI helps maintain process control, dial-in difficult PCBs, track defect trends and feedback positional errors or the need to perform an underwipe to the printer.

    The session starts with basic methods of SPI equipment and their measurement algorithms. It continues with tips for production implementation and setting inspection tolerances. It then introduces simple experimental methods that can be performed quickly and easily to improve yields.

    The differences between accuracy and repeatability are discussed, as are the effects of setting of reference planes and measurement thresholds. Finally, special features of some machines are highlighted, and their impact on the overall printing process output are discussed.

    Finally, new information from current research projects, if available, will be presented.


    Session 1, August 23, 2016
    1. Stencil Verification
    1.1. SPI verification
    1.2. Test coupons
    1.3. SEM images
    1.4. Cleaning before using
    2. Stencil Troubleshooting
    2.1. Physical damage
    2.2. Foil thickness
    2.3. Aperture size
    2.4. Aperture location
    2.5. Impact on AR & TE
    2.6. Cut Quality
    3. Underwiping
    3.1. Purpose and methods
    3.2. UV Test results
    3.3. Solvent requirements
    3.4. Solvent compatibility with solder pastes
    3.5. Solvent and paper compatibility with nanocoatings

    Session 2, August 25, 2016
    4. Automated Solder Paste Inspection (SPI)
    4.1. SPI basics
    4.2. Production implementation
    4.3. Setting inspection tolerances
    4.4. Improving print yields
    4.5. Accuracy and Repeatability
    4.6. Reference planes and measurement thresholds
    4.7. Special features to improve performance

    Who will benefit from this course?

  • SMT assembly process engineers and technicians responsible for production or new product introduction processes
  • Engineers and technicians just entering the SMT field who want to master the science and art of stencil printing
  • SMT quality personnel interested in helping improve print and end-of-line yields and identifying root causes of failures
  • OEM supply chain engineers responsible for supporting and/or assessing SMT assembly contractors

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webinar:
    Practical Guidelines in Handling Moisture Sensitivity of SMT Packages
    Tuesday, September 13, 2016
    1:00pm to 2:30pm Eastern
    Presented by: Mumtaz Bora, Sr. Staff Packaging Engineer, Peregrine Semiconductor

    Complimentary Webinar for Members!

    Handling of moisture sensitive packages is an ongoing learning process in volume manufacturing. Improperly handled and stored MSDs can impact yields and reliability. The presentation will cover a review of the industry standards for MSDs (J-STD-020, J-STD 033 and J-STD 075) and their applications in moisture control. PWBs used for assembly also require controlled storage and handling. Board surface finishes, storage and baking guidelines will be reviewed per the IPC 1601 standard. Handling of MSDs from receipt to use at reflow will be reviewed, including practical guidelines in labeling, tracking, packing, storage and supplier audits.

    About the Presenter:
    Mumtaz Y. Bora has a B.S. in Chemistry and Material Sciences from University of Mumbai, India and University of Ottawa, Canada. She has a Master of Science in Interactive Telecommunications from University of Redlands, California. She has over 25 years of PWB, SMT assembly and advanced packaging development experience at IBM Endicott and IBM Austin, TX. She has worked in new product development, and qualification of high volume handset assemblies at Qualcomm and Kyocera-Wireless Corporation. She has worked with suppliers and subcontractors in several parts of Asia. She is currently a Sr. Staff Packaging Engineer at Peregrine Semiconductor for qualification of RFIC packages for wireless, broadband Automotive and Hi-Rel/Space applications. She is a member of IPC standardization committees and contributes to the standards development. She has 16 publications and 3 patents. She is the Past President of the SMTA San Diego chapter and Co-chair of the Moisture Sensitive Devices Council. She is currently President of the IMAPS San Diego Chapter and Vice President of SMTA San Diego chapter.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webinar:
    The Three Fundamentals to the Ultimate Reliability in Consumer Electronics
    Thursday, November 3, 2016
    Two convenient times: 11:00am or 2:00pm Eastern
    Presented by: Craig Hillman, Ph.D., DfR Solutions

    Complimentary Webinar for Members!

    The standard rule for reliability has been consumer electronics are cheap, disposable, and poor quality and military/space are robust, long-lasting, and very expensive. What if somebody broke these rules? Can you have a low-cost piece of electronics with very high reliability? How would you do it? What would it mean for every other industry willing to pay large sums to meet market expectations of performance? In this presentation, Dr. Craig Hillman, who has consulted with over 1000 electronic OEMs on reliability, will discuss how certain organizations consistently out-perform their peers in quality and reliability. Based on years of observing multiple organizations in a variety of markets, Dr. Hillman has identified the three key fundamentals that drive reliability excellence. Attend this exclusive webinar and learn how to implement these philosophies into your organization, regardless of whether you are the Vice President of Quality or a beginner reliability engineer.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    Robotic Iron and Laser Soldering for Lead-Free and High Temperature Alloys
    Two (2) 90 minute Sessions
    Tuesday, November 8 and Tuesday, November 15, 2016

    12:00pm-1:30pm Eastern
    Presented by: Bob Willis, & NPL National Physical Laboratory

    When we start to talk about high temperature electronics it's not the solder it's all the parts that make up an electronic assembly. Substrates, components, connectors, cables, solder and all of the assembly process needs to be examined in detail. Some newer techniques of soldering can reduce the stress on boards and components and also need through put requirements of modern manufacture. Working at high temperature means between 150-200oC, however, there are many applications that have to work at much higher levels, up to 300oC. Typically the industries affected by these hostile working conductions include, aerospace, automotive, petrochemical and military. The use of selective soldering is used with high temperature materials and more recently there is a growth in the use of robotic laser and iron soldering. These systems are being used telecom and automotive producers with different cored wire combinations.

    High Temp Defects

    The webinar is a mixture or theory and practical assembly trial evaluation results with current and future technology using selective soldering plus laser and robotic iron soldering processes at NPL National Physical Laboratory . A FREE copy of the High Temperature Electronics Defect Guide will be provided to each delegate. The defect charts can be printed on site for future reference or training. A guide to major reference sources and publication on high temperature manufacture will be discussed and suppliers providing different assembly resources.

    High Temp Defects

    Topics may include:

  • Oil, Gas, Space, Automotive & Military Applications
  • Reference books, specification and standards
  • Product temperature range
  • Component compatibility
  • PCB substrate choices & specifications and design
  • Soldering alloy choices
  • Assembly & soldering options
  • Setting up and assessment of soldering systems
  • Critical choice in the selection of cored wire for automated assembly
  • Reliability assessment & testing results
  • Failure modes
  • Inspection of solder joints and new defect types

    Bob Willis Instructor Bob Willis
    Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Group Technical Committee. Although a specialist for companies implementing surface mount and area array technology Mr Willis has provided training and consultancy in most areas of electronic manufacture for over 30 years.

    Bob has conducted workshops and set up production lines, assembly features and his “NPL Process Advice and Defect Clinic” with all the major organisations and exhibition organisers worldwide like Productronica, Germany, IPC APEX, SMTAI in the USA plus National Electronics Week and Nepcon Electronics in UK.

    Bob was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and was elected Honorary President for life and currently holds the position of SMART Group Technical Manager, he has also worked on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers.

    Bob organises the NPL Defects Database on behalf of NPL and organises the Electronics Interconnection Division’s monthly online technology webinars and on site workshops. He has authored two books in the last couple of years on Pin In Hole Intrusive, Design & Assembly plus Package On Package Design Assembly & Quality Control which has been read by over 2000 engineers from around the world.

    Registrations are being taken through the SMTA Online Registration System.

    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.

  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.