CALL FOR PARTICIPATION
Leaders Learning from Leaders
Consider submitting an abstract for an upcoming SMTA educational program. See conference choices below.
All submissions must be non-commercial in nature and focus on technology research rather than a company product. | Please note: Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a written manuscript for the proceedings. |
SMTA China 2008:
The SMTA China cordially invites you to participate in SMTA China Conferences located in
Shanghai, Shenzhen and Tianjin for 2008. These events, held in conjunction with NEPCON China, NEPCON South China and Bohai Electronics Week, will address the industry’s most pressing issues in electronics manufacturing, advanced packaging and lead-free reliability. All papers including abstract and biography for inclusion in the Conference Proceedings requested in both Chinese and English. All papers (powerpoint) shall be presented in Chinese. Deadlines for Abstract Submission:
North Conference: 10 July 2008
The topics that we would like covered are:
01005 assembly 3D SiP (System in Package) PoP (Package on Package) Pb Free Processes and Product Reliability Component Supply Integrity Legal responsibility of non-RoHS part/product entering Europe Materials and Process Characterization Flex Circuit Assembly Challenges of PCB Fabrication Technology and Surface Finish Cost Reduction Initiative Advanced Low I/O Packaging Market Trends in Assembly Manufacture Manufacturing Engineering Process Control Excellence Production and Supply Chain Management RoHS Compliance and Materials Risk Free Rework/Repairing State of Art Inspection and Failure Analysis
We are currently looking for 30 minute technical papers as well as full and half day short courses. A written paper for inclusion in the Proceedings is required. All presentations must be made in Chinese.
If you or your company has pertinent information to share and you are looking for an opportunity to address an audience in China please let me know. You can e-mail a short abstract to me at joann@smta.org. Please include your name, job title, company affiliation, and all pertinent contact information.
We thank you for your support of the SMTA and our programming and look forward to hearing from you.
Please email Michael Wong, at peggy@smta.org, with questions and submissions.
 CALL FOR PAPERS
Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts
September 9-10, 2008
Samuel Riggs Alumni Center, University of Maryland, College Park, MD
SMTA and CALCE are pleased to announce that the 2nd Annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts will be held on September 9-10, 2008 at the University of Maryland, College Park, MD
A counterfeit electronic part is one whose identity (e.g., manufacturer, part number, date code, lot code) has been deliberately misrepresented. Counterfeit electronics have been reported in a wide range of products, including computers, telecommunications equipment, automobiles, avionics and military systems. Counterfeit electronics include everything from very inexpensive capacitors and resistors to costly microprocessors, completed assemblies and even systems.
Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry. Topics will include:
Methodologies followed by effected industries to mitigate chances of being victims of counterfeit parts Efforts and initiatives – both domestic and international that will effect the future of combating counterfeit electronic parts Supply chain management tools to mitigate counterfeit part risks Cleaning Requirements Tools being developed and used by part manufacturers for short and long term solutions for their customers and for brand protection Inspections tools and techniques for detecting counterfeit parts Impact of counterfeit parts on the military and avionics industry Sources of counterfeit parts Authentication techniques for securing electronic part supply chain
The conference is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to supply chain managers, component engineers, brand protection specialists, marketing and procurement policy makers, contracts management, security specialists and other interested engineers. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.
Please provide an abstract (within 300 words) on any relevant topics to Dr. Diganta Das via email to diganta@umd.edu no later than June 30, 2008. The presentations are due on August 16, 2008. Watch for additional symposium information at http://www.calce.umd.edu and at www.smta.org
For more information about conference participation or registration, contact Melissa Serres Marx at SMTA.
CALL FOR PARTICIPATION
High Performance Electronics Assembly Cleaning Symposium
October 28-29, 2008
Rosemont, IL
Submit an abstract for the industry’s premier conference on cleaning for electronics assembly. Developed and presented by the industry, for the industry, participation will guarantee significant visibility for you and your company for your research and knowledge.
The symposium will focus on all classes of high reliability and high performance electronics assembly and will include case studies from manufacturing experts in the aerospace and defense, automotive, consumer telecommunications, and medical products industries.
Hundreds of individuals will receive the technical proceedings, ensuring that your presentation is seen by key engineers, managers and executives from all segments of the electronics interconnection industry worldwide.
CONFERENCE TOPICS
Submissions are sought on cleaning in the following areas or other related areas: | Future Cleaning Challenges Cleanliness Assessment Cleaning Requirements Class 3 Cleaning Process No-Clean Process Spot Cleaning Cleaning for Conformal Coating
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Cleaning Agent Compatibility Constraints (for alloys, labels, components and board materials) Reflow Heat Gradients Environmental Issues Process Integration Cleaning Standards | Requirements for Submission
Provide an abstract of approximately 300 words that summarizes technical and previously unpublished, non-commercial work covering case histories, research and discoveries. The deadline for abstracts will be announced soon. Preference will be given to submissions for presentations in high reliability (including medical, military, automotive, aerospace, and telecommunications) and high volume production segments such as information technology.
The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to assess content of the proposed presentation. If selected, presentations will be due August 28, 2008. The submission should be non-commercial in nature and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results.
Conference Benefits
Conference speakers are entitled to a copy of the Proceedings and a free Conference registration.
Abstract and Proposal Instructions
To submit your abstract online click on the "Submit Abstract" tab above or email it to melissa@smta.org. For more information about conference participation or registration, contact Jean Hebeisen at JeanHebeisen@ipc.org or Melissa Serres Marx at SMTA.
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One of the ways SMTA enables its members to achieve professional success is by providing unparalleled educational programs and events. Read the brief descriptions below of the respective links on the left nav bar.