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SMT North America, Inc.

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Educational Opportunity One of the ways SMTA enables its members to achieve professional success is by providing unparalleled educational programs and events. Read the brief descriptions below of the respective links on the left nav bar.

SMTA International: The association's annual conference, which features exhibit opportunities, courses, paper sessions, panel discussions, lectures, and other special events.
The Pan Pacific Symposium: An international event with exhibit opportunities, special events, and paper sessions on microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.
The International Wafer-Level Packaging Conference (IWLPC): Sponsored jointly by Chip Scale Review magazine and the SMTA, the IWLPC and Tabletop Exhibition tracks leading-edge IC packaging and test technologies with special emphasis on 3D stacked packaging.
The Academy Program: Half- and full-day courses that are intended to target audiences with offerings tailored for the local professionals of a particular geographic area.
Symposia: Events that focus on one general topic that do so by paper sessions, panel discussions, lectures, and related special events.
Chapter Tutorials: Like the Academy Program, these are tailored locally but feature just one speaker addressing the chosen topic.
Chapter News: A summary of events planned independently by local SMTA officers, including anything from technical presentations and facility tours to networking events and golf outings.
On-line Presentations: 90-minute broadcasts using telecon audio, Web file downloads, and email for submitting questions, featuring speakers on specific, timely topics.

See below for opportunities to present your research during an SMTA event.
Submit an article to the SMTA director of communications & IT for the SMTA Journal.

Also search the Knowledge Base of nearly 2000 technical articles of the type featured at SMTA events.
Browse the Bookstore for examples of proceedings that have been produced at SMTA events.


Tutorial Guidelines
The SMTA is committed to providing its members access to the best training and continuous learning opportunities in the industry. This document outlines the mechanism by which tutorial programs will be solicited, selected, deployed, and assessed. The intent of these guidelines is to:
  • Provide the highest quality tutorials to the industry
  • Provide context applicable to current state of the industry
  • Provide a fair and transparent means of tutorial selection
  • Establish a feedback loop for continuous improvement of the tutorial program
    Click here to view the guidelines. If you have comments or suggestions please contact JoAnn Stromberg (joann@smta.org) or Melissa Serres Marx (melissa@smta.org)



  •  
    CALL FOR PARTICIPATION
    Leaders Learning from Leaders

    Consider submitting an abstract for an upcoming SMTA educational program. See conference choices below.

    All submissions must be non-commercial in nature and focus on technology research rather than a company product.
    Please note: Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a written manuscript for the proceedings.



    CALL FOR PRESENTATIONS

    High Performance Electronics Cleaning and Coating Symposium
    September 30, 2009
    Coventry, England


    Submit an abstract for the industry’s premier conference on cleaning for electronics assembly. Developed and presented by the industry, for the industry, participation will guarantee significant visibility for you and your company for your research and knowledge.

    The symposium will focus on all classes of high reliability and high performance electronics assembly and will include case studies from manufacturing experts in the aerospace and defense, automotive, consumer telecommunications, and medical products industries.

    Hundreds of individuals will receive the technical proceedings, ensuring that your presentation is seen by key engineers, managers and executives from all segments of the electronics interconnection industry worldwide.

    CONFERENCE TOPICS
    Submissions are sought on cleaning in the following areas or other related areas:
  • IPC cleaning equipment
  • REACH,WEEE & RoHS Impacts
  • Cleaning standards
  • Cleaning process
  • Lead-free flux technology and the influence on cleaning
  • How clean is clean?
  • Coating process considerations
  • Qualifying lead-free medical electronics
  • Environmental issues
  • Requirements for Submission
    Provide an abstract of approximately 300 words that summarizes technical and previously unpublished, non-commercial work covering case histories, research and discoveries. Abstracts must be received by June 30, 2009. Preference will be given to submissions for presentations in high reliability (including medical, military, automotive, aerospace, and telecommunications) and high volume production segments such as information technology.

    The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to assess content of the proposed presentation. If selected, presentations will be due August 28, 2008. The submission should be non-commercial in nature and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results.

    Conference Benefits
    Conference speakers are entitled to a copy of the Proceedings and a free Conference registration.

    Abstract and Proposal Instructions
    To submit your abstract online click on the "Submit Abstract" tab above or email it to melissa@smta.org. For more information about conference participation or registration, contact Tina Nerad at TinaNerad@ipc.org or Melissa Serres Marx at SMTA.



    Call for Presentations
    Medical Electronics Symposium:
    Drivers for Technology, Health and the Economy


    The SMTA and MEPTEC are pleased to announce the combination of their 2009 Medical Electronics Symposia. The two-day technical program will be held September 16-17, 2009 at Arizona State University in Tempe, AZ. ASU’s College of Nursing and Healthcare Innovation will co-sponsor this event.

    Conference Chairs Dale Lee (Plexus Corporation), Nick Leonardi (Premier Semiconductor Services), Ron Molnar (AZ Tech Direct), and Dave Ruben (Medtronic Microelectronics) cordially invite you to submit an abstract for consideration.

    This symposium will focus on medical electronics and medical device applications. The technical committee is soliciting abstracts from within the medical community that will share the most up to date information about company electronics expertise, practices, technology and applications as it relates to the symposium topics.

    There is no technical paper requirement for this symposium. Presentations are due on August 12, 2009.

    Session topics include:

  • Market Trends & Forecast in Medical Electronics
  • Emerging Materials & Technologies
  • Component Manufacturing, including Sensors (chip & packaging level, etc.)
  • System Level Products and Applications – instrumentation (defibrillators, etc.)
  • Materials and Design
  • Systems Manufacturing (ie. PWB/PCB assembly, stacked packages)
  • Reliability/Safety/Regulatory/Testing
  • Implantable Products and Applications


  • The abstract and presentation must be non-commercial in nature and emphasize the medical technology and not the company portfolio. Please include your contact information (address, phone number, email address) and a presentation title with your abstract submission.

    Please provide an abstract of 300 words minimum on any of the topics above by email to SMTA Director of Education Melissa Serres Marx. Abstracts can also be uploaded by clicking on the "submit abstract" tab above.

    Deadline for abstracts has been extended to June 30, 2009.

    Watch for additional symposium information on the Medical Electronics Symposium Web page.



    SMTA South East Asia Technical Conference on Electronics Assembly Technologies
    Call for Presentations



    November 19-20, 2009
    Equatorial Hotel
    Penang, Malaysia

    You are invited to submit an abstract to the SMTA’s newest technical event in Penang, Malaysia. Presentations are sought in the following key technology tracks:

    Assembly
  • Lean Manufacturing
  • Low volume / Prototype assembly
  • Medical electronic
  • Rework and repair of QFN’s
  • Selective Soldering
  • Set up reduction
  • Vapor phase reflow for high reliability assemblies
  • Yield Improvement
  • Under fill Applications and issues


  • Components
  • Chip scale packages, including WL-CSP, LGA
  • Multichip packages, including 3D packaging
  • Tin Whiskers
  • Emerging Technologies

  • Embedded Technology/ Actives and Assembly
  • Optoelectronics
  • Solar Technology
  • System in a Package
  • Power and Thermal Management


  • Harsh Environment Applications
  • Lead Free issue for Harsh environments
  • Potting
  • Conformal Coating


  • PCB Technology
  • Black pad and surface finish defects
  • Halogen Free, ROHS, Green products requirements
  • Abstracts (300 words) are due July 6, 2009. The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Please include your contact information (address, phone number, email address) and a presentation title with your abstract submission. Abstracts can be uploaded by clicking on the "upload abstracts" tab above.

    Contact the Conference Coordinator, Melissa Serres Marx, with questions or comments.



     


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