CALL FOR PARTICIPATION
Your Research Matters - Share Your Knowledge
| Because of the dedication of engineers just like you, the electronics assembly and advanced packaging industries have seen tremendous growth over the years. Remember, every little bit helps and your research is beneficial to engineers all over the world. By presenting a technical paper at a conference you can contribute to the general advancement of the electronics industry as well as establish yourself and your company as an innovator and a thought leader. Get started by submitting an abstract for one of our upcoming conferences. || Please note: Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a technical paper for the proceedings. |
All submissions must be non-commercial in nature and focus on technology research rather than a company product.
Upcoming Events Currently Accepting Abstracts:
Download a printable list of events
South East Asia Technical Training Conference on Electronics Assembly Technologies 2014
Abstracts Due: December 20th, 2013
International Conference on Soldering and Reliability (ICSR)
Abstracts Due January 15th, 2014
Journal of SMT
Now Accepting for next quarter's publication - Contact Ryan, firstname.lastname@example.org
On-line Presentations (Webinars & Webtorials)
Now Scheduling for 2014 - Contact Patti, email@example.com
SMTA South East Asia Technical Conference on Electronics Assembly Technologies
Call for Presentations
April 8-10, 2014
Abstracts Due December 20th
You are invited to submit an abstract to the SMTA's newest technical event in Penang, Malaysia. Presentations are sought in the following key technology tracks:
| Assembly |
Adhesives, Alternate Alloys, BGA/CSP Assembly Cleaning Connector Technology Copper Erosion DFX/Design for Six Sigma Equipment Selection Facility Layout Flux and Solder Halogen and Halogen-Free Head-in-Pillow Defect Land Pattern Design Lead-Free Soldering (including case studies) Lead-Free Reliability Lean Manufacturing Low Volume / Prototype Assembly Medical Electronics Placement Printing Reflow Soldering Rework and Repair of QFNs RFID Assembly Selective Soldering Set Up Reduction Solder Paste Solder Voids Supplier Engineering Underfill Vapor Phase Reflow for High Reliability Assemblies Wave Soldering Yield Improvement
BGA Battery Interactions BTCs (Bottom Termination Components) CSP (including Wafer-Level Packages) Component Solderability Component Reliability Connectors Embedded Passives Failure Analysis Fine Pitch Technology Flip Chip / Direct Chip Attach Lead/Termination Finish Leadless Packaging Multichip Packages (including 3-D Packaging Package on Package) Tin Whiskers
Emerging Technologies0201/01005 Components and Assembly Consumer Applications Counterfeit Electronics Electronic Printing Technology Embedded Technology / Actives and Assembly Flexible Electronics MEMS/RF MEMS/MOEMS Nanoelectronics Reliability of Nanodevices New Materials and Processes Optoelectronics Power or Thermal Management Sensors and Manufacturing Solar Technology System in a Package Thermal Interface Materials Wireless Applications including Bluetooth and Wi-Fi
Harsh Environment Applications
Components and Component Reliability Lead-free Issues for Harsh Environments Substrates Thermal Management
PCB TechnologyBlack Pad and Surface Finish Defects Embedded Passive and Active Components Halogen Free HDI Microvias (including filled and unfilled) Moisture Sensitivity Soldermask Substrate Reliability & Solderability Surface Finish Pros and Cons
Process ControlAcoustic Imaging AOI CIM In-Circuit Test Process Modeling Software Test Strategies X-Ray
BusinessCapacity Modeling Contract Manufacturing Doing Business in Asia Environmental Issues Lean Manufacturing / Quality Initiatives Operations Management Remaining Competitive RoHS Compliance Supplier Management Technology Roadmap
Also Accepting Course Abstracts on SMT and Semiconductor, LED, Photovoltaic, and Nano-Technology and any other topics you wish to submit. When you submit your abstract pleas indicate if it is a course.
Abstracts (300 words) are due December 20th, 2013. The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Please include your contact information (address, phone number, email address) and a presentation title with your abstract submission. Abstracts can be uploaded by clicking on the "upload abstracts" tab above.
Contact SMTA Director of Education, Patti Hvidhyld, Patti@smta.org, with questions or comments.
Call for Papers: International Conference on Soldering & Reliability (ICSR)
May 13-15, 2014
Toronto, Ontario, Canada
Electronic products, particularly consumer products have become more complex with greater circuit density, finer lines and spacings and more functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require materials, manufacturing, test and quality engineers and scientists to be creative in planning for the future. Challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies are included. Due to cost considerations, new low silver or silver free alloys are being studied. The use of tailored alloy systems, the variety of alloy choices, and smaller passive components are among the concerns being addressed. Now, a new group of engineers and scientists involved in the design and manufacture of (a) medical devices, and (b) monitoring and control instruments must be ready for the requirements of RoHS recast, also known as RoHS 2. The following are the dates for compliance: July 22, 2014 – medical devices and monitoring and control instruments; July 22, 2016 – in vitro diagnostic medical devices; July 22, 2017 – industrial monitoring and control equipment; and July 22, 2019 – electrical and electronic equipment which falls outside the scope of the original RoHS Directive. Soldering and reliability professionals need to come together to share their knowledge and their vision for addressing these challenges.
ICSR has been a very successful conference for many years. Show off your company’s expertise by presenting a paper. Past companies that have presented: Indium Corporation, IBM Corporation, BAE, Kyzen, Blackberry (Research in Motion), Creation Technologies, DfR Solutions, Celestica, University of Toronto
ABSTRACTS DUE DATE JANUARY 15, 2014
Suggested topics to be covered include:
| Lead-free Assembly and Test Reliability Harsh Environment Tin Whiskers New Alloys Electromigration Thermal Dissipation Environmental Compliance/Regulations Conformal Coating Nano-interconnects || |
Manufacturing Process Package on Package Corrosion Halogen-Free Laminates High Density Interconnects Thermal Interface Materials Underfill Printed Electronics Die Attach Soldering & L-F Challenges Nano-scale soldering
If you would like to present at this conference, please submit a 200-300 word abstract to Patti Hvidhyld at firstname.lastname@example.org. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by February 3, 2014. Technical papers are required and will be due on March 31, 2014
The conference is co-sponsored by the SMTA Toronto Chapter.
Questions? Please contact:
Patti Hvidhyld, SMTA Director of Education