One of the ways SMTA enables its members to achieve professional success is by providing unparalleled educational programs and events. The list below describes the various opportunities available to you.
SMTA International:  The association's annual conference, which features exhibit opportunities, courses, paper sessions, panel discussions, lectures, and other special events.
The Pan Pacific Symposium:  An international event with exhibit opportunities, special events, and paper sessions on microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.
The International Wafer-Level Packaging Conference (IWLPC):  Sponsored jointly by Chip Scale Review magazine and the SMTA, the IWLPC and Tabletop Exhibition tracks leading-edge IC packaging and test technologies with special emphasis on 3D stacked packaging.
The Academy Program: Half- and full-day courses that are intended to target audiences with offerings tailored for the local professionals of a particular geographic area.
Symposia: Events that focus on one general topic that do so by paper sessions, panel discussions, lectures, and related special events.
Chapter Tutorials: Like the Academy Program, these are tailored locally but feature just one speaker addressing the chosen topic.
Chapter News: A summary of events planned independently by local SMTA officers, including anything from technical presentations and facility tours to networking events and golf outings.
On-line Presentations (Webinars & Webtorials):  Educational online broadcasts featuring speakers on specific, timely topics. Learn right from your desk!
Knowledge Base: Search our Knowledge Base of 2000+ technical articles from SMTA-sponsored events.
SMTA BookStore: Browse the BookStore for proceedings that have been produced at SMTA events.
Journal of SMT: Submit an article to the SMTA director of communications & IT for the SMTA Journal.
Tutorial Guidelines
The SMTA is committed to providing its members access to the best training and continuous learning opportunities in the industry. This document outlines the mechanism by which tutorial programs will be solicited, selected, deployed, and assessed. The intent of these guidelines is to:
Provide the highest quality tutorials to the industry
Provide context applicable to current state of the industry
Provide a fair and transparent means of tutorial selection
Establish a feedback loop for continuous improvement of the tutorial program
Click here to view the guidelines. If you have comments or suggestions please contact JoAnn Stromberg (joann@smta.org) or Melissa Serres (melissa@smta.org)
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CALL FOR PARTICIPATION
Leaders Learning from Leaders
Consider submitting an abstract for an upcoming SMTA educational program. See conference choices below.
All submissions must be non-commercial in nature and focus on technology research rather than a company product. | Please note: Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a written manuscript for the proceedings. |
SMTA South East Asia Technical Conference on Electronics Assembly Technologies
Call for Presentations 
May 19-20, 2011
Eastin Hotel
Penang, Malaysia
Abstracts due: August 20, 2010
You are invited to submit an abstract to the SMTA's newest technical event in Penang, Malaysia. Presentations are sought in the following key technology tracks:
Assembly
Adhesives, Alternate Alloys, BGA/CSP Assembly Cleaning Connector Technology Copper Erosion DFX/Design for Six Sigma Dispensing Equipment Selection Facility Layout Flux and Solder Halogen and Halogen-Free Head-in-Pillow Defect Land Pattern Design Lead-Free Soldering (including case studies) Lead-Free Reliability Lean Manufacturing Low Volume / Prototype Assembly Medical Electronics Placement Printing Reflow Soldering Rework and Repair of QFNs RFID Assembly Selective Soldering Set Up Reduction Solder Paste Solder Voids Supplier Engineering Underfill Vapor Phase Reflow for High Reliability Assemblies Wave Soldering Yield Improvement
Components
BGA Battery Interactions BTCs (Bottom Termination Components) CSP (including Wafer-Level Packages) Component Solderability Component Reliability Connectors Embedded Passives Failure Analysis Fine Pitch Technology Flip Chip / Direct Chip Attach Lead/Termination Finish Leadless Packaging Multichip Packages (including 3-D Packaging Package on Package) Tin Whiskers
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Emerging Technologies
0201/01005 Components and Assembly Consumer Applications Electronic Printing Technology Embedded Technology / Actives and Assembly Flexible Electronics MEMS/RF MEMS/MOEMS Nanoelectronics Reliability of Nanodevices New Materials and Processes Optoelectronics Power or Thermal Management Sensors and Manufacturing Solar Technology System in a Package Thermal Interface Materials Wireless Applications including Bluetooth and Wi-Fi
Harsh Environment Applications
Components and Component Reliability Lead-free Issues for Harsh Environments Substrates Thermal Management
PCB Technology
Black Pad and Surface Finish Defects Embedded Passive and Active Components Halogen Free HDI Microvias (including filled and unfilled) Moisture Sensitivity Soldermask Substrate Reliability & Solderability Surface Finish
Process Control
Acoustic Imaging AOI CIM In-Circuit Test Process Modeling Software Test Strategies X-Ray
Business
Capacity Modeling Contract Manufacturing Doing Business in Asia Environmental Issues Lean Manufacturing / Quality Initiatives Operations Management Remaining Competitive RoHS Compliance Supplier Management Technology Roadmap
| The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Please include your contact information (address, phone number, email address) and a presentation title with your abstract submission. Abstracts can be uploaded by clicking on the "upload abstracts" tab above.
Contact the Conference Coordinator, Bernie Selva, bernie@smta.org, or Melissa Serres, melissa@smta.org, with questions or comments.
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