One of the ways SMTA enables its members to achieve professional success is by providing unparalleled educational programs and events. The list below describes the various opportunities available to you.
Contamination, Cleaning and Coating Conference
High Reliability Cleaning and Coating Conference
International Conference on Soldering and Reliability (ICSR)
International Wafer-Level Packaging Conference (IWLPC)
LED Assembly, Reliability, & Testing (A.R.T.) Symposium
Pan Pacific Microelectronics Symposium
Southeast Asia Technical Conference on Electronics Assembly
Symposium on Counterfeit Parts and Materials
Do you want to help ensure SMTA technical programs continue to offer the high quality technical information for which SMTA is known? Join the SMTA Technical Committee.
If you have comments or suggestions please contact Tanya Martin (email@example.com) or Jenny Ng (firstname.lastname@example.org)
Achieve professional success by contributing to SMTA's unparalleled educational programs and events on the latest research on lead-free soldering and reliability, advanced packaging and components, wafer-level packaging, cleaning, counterfeit components, supply chain and process control.
Because of the dedication of engineers just like you, the electronics assembly and advanced packaging industries have seen tremendous growth over the years. Remember, every little bit helps and your research is beneficial to engineers all over the world. By presenting a technical paper at a conference you can contribute to the general advancement of the electronics industry as well as establish yourself and your company as an innovator and a thought leader. Get started by submitting an abstract for one of our upcoming conferences.
RequirementsSubmission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a technical paper for the proceedings. All submissions must be non-commercial in nature and focus on technology research rather than a company product.
Upcoming Events Currently Accepting Abstracts:
SMTA International Abstracts Deadline: February 24, 2017
September 17 - 21, 2017 | Rosemont, IL, USA
International Conference on Soldering and Reliability (ICSR) Abstracts Deadline: February 28, 2017
June 6-8, 2017 | Markham, ON, Canada
SMTA/CALCE Symposium on Counterfeit Parts and Materials Abstract Deadline: March 20, 2017
June 27-29, 2017 | College Park, MD
International Wafer-Level Packaging Conference (IWLPC) Abstract Deadline Extended: April 10, 2017
October 24-26, 2017 | San Jose, CA
Journal of SMT Now Accepting for next quarter's publication - Contact Ryan, email@example.com
On-line Presentations (Webinars & Webtorials)
Now Scheduling for 2017 - Contact Jenny Ng, firstname.lastname@example.org
Join the Technical CommitteeDo you want to help ensure SMTA technical programs continue to offer the high quality technical information for which SMTA is known? Join the SMTA Technical Committee.