SMTA China South Conference - Shenzhen
27-30 August 2012
Shenzhen Convention & Exhibition Centre
Latest info for download:
Full Conference Program
Technical Conference Schedule
Certification Form - English/Chinese
The SMTA China will organize the SMTA China South Conference 2012 in Shenzhen on 28-30
August, 2012. This timely event will be held in conjunction with NEPCON South China 2012 and
will address the industry's most pressing issues in electronics assembly/manufacturing,
industry/technology roadmap, business focus, advanced packaging, practical skill development,
emerging technologies, and lead-free & reliability.
Technology Conference/Vendor Conference Topics (28-30 August 2012)
Environment Friendly Operation
Lead-free alloys in combination with surface finishes. How do new alloys perform on
different surface finishes?
Tin whiskers, board cleaning, environmental issues.
Solar and/or other alternative energy topics.
Alternative solder materials.
Lead-free reliability studies.
Bare board process assessment or benchmarking-how to define process capability limits of
PWB supplies beyond IPC-1710 audit form.
Best profile for reflow.
Solder paste printing, how to develop paste printing SPC process
PCB surface delamination by excess heat.
Inspection of solder connections between connector and PWB-residual flux, in particular
Reliability testing for Pb-free solders-what tests to do and at what levels?
Printed electronics-circuit boards and passives
PCB/laminate issues. Failure analysis.
Effective PCBA reworking
Intrusive solder on lead-free
Emerging Technology Focus
PoP rework/repair. PoP process control
Practical PoP assembly issues, rework of LGAs
Flexible electronics-assembly/packaging, etc.
Advanced next generation packages/process topics (i.e. flexible substrate bumping).
Alternative soldering mechanism, induction solddering, laser soldering, solderless connections, etc.
Alternative PCB finish, etc.
Technology Workshop (27 August 2012)
We will hold three half day courses on 27 August. The topic is "Package on Package Technology" by Dr. Ningcheng Lee of Indium. The topic is "Edgebond Epoxy Adhesives for the Improvement of Board Level Reliability of Connector, PBGA and CBGA Packages" by Dr. Fubing Song of Celestica. The topic is " 6 Sigma Total Quality SMT Process Control" by Gerry Chen, Engineering Supervisor of Embedded Computing and Power of Emerson Network Power. SMTA China will issue the workshop course certification after the course.
SMT Engineer Certification (28-30 August 2012)
SMTA Engineer Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes.
Certification Form - English/Chinese
SMTA Hong Kong Chapter Annual Breakfast Reception (29 August 2012)
It is a great opportunity to meet with our friends in the SMT Industry at the SMTA Hong Kong Chapter Annual Breakfast Reception. In addition, in order to appreciate the speakers of excellent information sharing, SMTA China would like to honor the best paper, and the speakerof best presentation, which award will be presented during the Annual Breakfast Reception of SMTA Hong Kong Chapter.
SMTA Hong Kong Chapter Golf Tournament (25 August 2012)
SMTA Hong Kong Chapter will organize the Annual Golf Tournament at Yan Li Golf Club (Dongguan Oingxi, China) on 25 August.
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