Call for Papers for the 2013 Technology Conference
The SMTA China cordially invites you to participate in SMTA China East Conference located in Shanghai and SMTA China South Conference located in Shenzhen for 2013. This event, held in conjunction with NEPCON China 2013 and NEPCON South China 2013, will as usual address the industry's most pressing issues in electronics assembly/ manufacturing, industry/ technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.
Topical coverage includes:
Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Conformal Coating and Potting, Connector Technology, Copper Erosion, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Halogen and Halogen-Free, Head on Pillow Defect/Warpage Induced Solder Joint Defects, High Melting Point Solder, Land Pattern Design, Lead-Free Soldering/Reliability, Lean Manufacturing, Low Temperature Soldering, Low Volume/Prototype, Medical Electronics, Placement, Printing, Reflow Soldering, Rework and Repair of QFNs, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Solder Voids, Supplier Engineering, Underfill and Corner Glue, Vapor Phase Reflow, Wave Soldering, and Yield Improvement.
Business: Capacity Modeling, Conflict Minerals, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing / Quality Initiatives, Operations Management, Remaining Competitive, RoHS/REACH Compliance, Supplier Management, and Technology Roadmaps.
Emerging Technologies: 0201/01005 Components/Assembly, Advanced Packaging, Consumer Applications, Electronic Printing Technology, Embedded Technology, Flexible Electronics, MEMS/RF, MEMS/MOEMS, Microsystems Packaging / Modular Microsystems, Nanoelectronics, Reliability of Nanodevices, New Materials and Processes, Optoelectronics, Printed Electronics, Power or Thermal Management, Sensors and Manufacturing, Solar Technology, Solid State Lighting, System in a Package, Thermal Interface Materials, Wireless Applications.
Harsh Environment Applications: Alternate Energy, Components and Component Reliability, Corrosion, Lead-free Issues, Substrates and Finishes, Thermal Management, and Tin Whiskers.
PCB Technology: Black Pad and Surface Finish Defects, Creep Corrosion, Embedded Passive and Active Components, Halogen Free, HDI, Microvias (including filled and unfilled), Moisture Sensitivity, Soldermask, Substrate Reliability, Substrate Solderability, and Surface Finish.
Process Control: Acoustic Imaging (C-SAM), AOI, CIM, In-Circuit Test, Process Modeling, Software, Solder Paste Inspection, Test Strategies, and 2D/3D X-Ray
Inclusion in the Technology Conference requires strictly technical papers (complimentary presentation slot for speakers) subject to final acceptance by the Technical Advisory Committee of SMTA China. All papers including abstract and biography for inclusion in the Conference Proceedings requested in both Chinese and English. All papers (powerpoint) suggest to be written and must presented in Chinese (translator provided by your company)
If you or your company wishes to share pertinent information with the highly qualified audience of SMTA China please submit your abstract to Peggy Chen by email to firstname.lastname@example.org. Please include your name, job title, company affiliation, and all pertinent contact information as well as your choice of Technology Conference to present your paper.
Submit an abstract
Deadlines for bilingual Abstract and bilingual Speaker Bio submission:
SMTA China East Conference in Shanghai: 31 January 2013
SMTA China South Conference in Shenzhen: 15 June 2013
To show our appreciation for the high level of information sharing by the speakers, SMTA China would like to honor the best paper, and the speaker of best presentation, which award will be presented during the above SMTA events.
Thank you for your support of SMTA China and we look forward to hearing from you.
For more information about SMTA China, our activities and programs, please contact: