Free Technical Program & Schedule:

8:30AM
Registration opens

The SMTA Ohio Chapter would like to invite you to attend the following technical presentations from three renowned technical speakers.

9:15AM – 10:00AM
Effects of Thermal Pad Patterning on QFN Voiding
Mario Scalzo, Senior Technical Support Engineer, Indium Corporation

Voiding under QFN’s is a major challenge in the electronics industry. However, voiding can be suppressed by improving venting accessibility on the thermal pad by using solder mask dividing strips. Venting accessibility is defined as the perimeter length per unit area of the metal pad. Regardless of the shape and number of subpads, increasing venting accessibility results in a decrease in the total number of voids, the largest voids, and discontinuity. Voiding caused by peripheral vias is comparable to voids caused by hidden vias. Voiding increases with decreasing print coverage and is attributed to insufficient solder. Voiding also decreases with an increase in the number of thermal vias. This phenomenon is attributed to volatiles bleeding through the small voids around the thermal via.

11:15AM – 12:00PM
The Top 7 Current Rework Challenges of BGA and QFN Packages
Bob Wetterman, IPC Master Instructor, BEST Inc.

With the proliferation of leadless device packages their rework has continued to be a challenge as solder voiding, open connections at the IO pads along with inspection of the devices continues to be problematic. In this session the challenges of leadless device rework, the methods of removal and replacement and their advantages/disadvantages will be outlined. Bob will discuss the “Challenges in BGA Rework” including examples of: Cheap Solder Mask, Masking off Nearby Components, Warping, Site Prepping without Damage, Micro Device Reballing, POP Rework, TMV Rework. Bring your own challenges for the larger group discussion at the end of this session.

12:00PM-1:30PM
Free HOT Lunch on Exhibit Floor
Special thanks to our lunch sponsor:

1:15PM - 2:00PM
Cleaning Flux Residue Under Bottom Termination Components
Debbie Alavezos-Carboni, National Sales Manager, Kyzen Corporation

Manufacturers today are cleaning not just to remove flux residue. We will explore the concerns of leaving these other contaminants and especially no-clean flux residue on modern electronic assemblies. Many such devices incorporate Bottom Termination Components (BTC); which limit access of the cleaning fluid to the soil. Bottom Termination Components consist of any surface mount device whose external connections consist of metalized terminations that are an integral part of the circuit assembly. Common BTC examples include QFN, DFN, SON, LGA, MLP, and MLF packages. Critical variables for removing flux residues and other contaminants are the cleaning agent, heat exposure, gap height (BTC to board), and fluid flow dynamics. The cleaning agent must match up to the soil in order to solubilize and carry it away. Efficient mechanical energy is also required to deliver the cleaning agent to these residues which often under fill the component. The purpose of this research is to better understand why so many manufacturers are cleaning their no-clean assemblies and to provide general process conditions that will successfully remove flux residue and other contamination from under and around modern BTC components. The target audience for this presentation is managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, cleaning, inspection, and repair processes.

3:00PM
Raffle on Exhibit Floor

Current Exhibitor List:

Free Technical Program & Schedule:

8:30AM
Registration opens

The SMTA Ohio Chapter would like to invite you to attend the following technical presentations from three renowned technical speakers.

9:15AM – 10:00AM
Effects of Thermal Pad Patterning on QFN Voiding
Mario Scalzo, Senior Technical Support Engineer, Indium Corporation

Voiding under QFN’s is a major challenge in the electronics industry. However, voiding can be suppressed by improving venting accessibility on the thermal pad by using solder mask dividing strips. Venting accessibility is defined as the perimeter length per unit area of the metal pad. Regardless of the shape and number of subpads, increasing venting accessibility results in a decrease in the total number of voids, the largest voids, and discontinuity. Voiding caused by peripheral vias is comparable to voids caused by hidden vias. Voiding increases with decreasing print coverage and is attributed to insufficient solder. Voiding also decreases with an increase in the number of thermal vias. This phenomenon is attributed to volatiles bleeding through the small voids around the thermal via.

11:15AM – 12:00PM
The Top 7 Current Rework Challenges of BGA and QFN Packages
Bob Wetterman, IPC Master Instructor, BEST Inc.

With the proliferation of leadless device packages their rework has continued to be a challenge as solder voiding, open connections at the IO pads along with inspection of the devices continues to be problematic. In this session the challenges of leadless device rework, the methods of removal and replacement and their advantages/disadvantages will be outlined. Bob will discuss the “Challenges in BGA Rework” including examples of: Cheap Solder Mask, Masking off Nearby Components, Warping, Site Prepping without Damage, Micro Device Reballing, POP Rework, TMV Rework. Bring your own challenges for the larger group discussion at the end of this session.

12:00PM-1:30PM
Free HOT Lunch on Exhibit Floor
Special thanks to our lunch sponsor:

1:15PM - 2:00PM
Cleaning Flux Residue Under Bottom Termination Components
Debbie Alavezos-Carboni, National Sales Manager, Kyzen Corporation

Manufacturers today are cleaning not just to remove flux residue. We will explore the concerns of leaving these other contaminants and especially no-clean flux residue on modern electronic assemblies. Many such devices incorporate Bottom Termination Components (BTC); which limit access of the cleaning fluid to the soil. Bottom Termination Components consist of any surface mount device whose external connections consist of metalized terminations that are an integral part of the circuit assembly. Common BTC examples include QFN, DFN, SON, LGA, MLP, and MLF packages. Critical variables for removing flux residues and other contaminants are the cleaning agent, heat exposure, gap height (BTC to board), and fluid flow dynamics. The cleaning agent must match up to the soil in order to solubilize and carry it away. Efficient mechanical energy is also required to deliver the cleaning agent to these residues which often under fill the component. The purpose of this research is to better understand why so many manufacturers are cleaning their no-clean assemblies and to provide general process conditions that will successfully remove flux residue and other contamination from under and around modern BTC components. The target audience for this presentation is managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, cleaning, inspection, and repair processes.

3:00PM
Raffle on Exhibit Floor

Current Exhibitor List:

Free Technical Program & Schedule:

8:30AM
Registration opens

The SMTA Ohio Chapter would like to invite you to attend the following technical presentations from three renowned technical speakers.

9:15AM – 10:00AM
Effects of Thermal Pad Patterning on QFN Voiding
Mario Scalzo, Senior Technical Support Engineer, Indium Corporation

Voiding under QFN’s is a major challenge in the electronics industry. However, voiding can be suppressed by improving venting accessibility on the thermal pad by using solder mask dividing strips. Venting accessibility is defined as the perimeter length per unit area of the metal pad. Regardless of the shape and number of subpads, increasing venting accessibility results in a decrease in the total number of voids, the largest voids, and discontinuity. Voiding caused by peripheral vias is comparable to voids caused by hidden vias. Voiding increases with decreasing print coverage and is attributed to insufficient solder. Voiding also decreases with an increase in the number of thermal vias. This phenomenon is attributed to volatiles bleeding through the small voids around the thermal via.

11:15AM – 12:00PM
The Top 7 Current Rework Challenges of BGA and QFN Packages
Bob Wetterman, IPC Master Instructor, BEST Inc.

With the proliferation of leadless device packages their rework has continued to be a challenge as solder voiding, open connections at the IO pads along with inspection of the devices continues to be problematic. In this session the challenges of leadless device rework, the methods of removal and replacement and their advantages/disadvantages will be outlined. Bob will discuss the “Challenges in BGA Rework” including examples of: Cheap Solder Mask, Masking off Nearby Components, Warping, Site Prepping without Damage, Micro Device Reballing, POP Rework, TMV Rework. Bring your own challenges for the larger group discussion at the end of this session.

12:00PM-1:30PM
Free HOT Lunch on Exhibit Floor
Special thanks to our lunch sponsor:

1:15PM - 2:00PM
Cleaning Flux Residue Under Bottom Termination Components
Debbie Alavezos-Carboni, National Sales Manager, Kyzen Corporation

Manufacturers today are cleaning not just to remove flux residue. We will explore the concerns of leaving these other contaminants and especially no-clean flux residue on modern electronic assemblies. Many such devices incorporate Bottom Termination Components (BTC); which limit access of the cleaning fluid to the soil. Bottom Termination Components consist of any surface mount device whose external connections consist of metalized terminations that are an integral part of the circuit assembly. Common BTC examples include QFN, DFN, SON, LGA, MLP, and MLF packages. Critical variables for removing flux residues and other contaminants are the cleaning agent, heat exposure, gap height (BTC to board), and fluid flow dynamics. The cleaning agent must match up to the soil in order to solubilize and carry it away. Efficient mechanical energy is also required to deliver the cleaning agent to these residues which often under fill the component. The purpose of this research is to better understand why so many manufacturers are cleaning their no-clean assemblies and to provide general process conditions that will successfully remove flux residue and other contamination from under and around modern BTC components. The target audience for this presentation is managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, cleaning, inspection, and repair processes.

3:00PM
Raffle on Exhibit Floor

Current Exhibitor List: