Upper Midwest (Minnesota, Iowa & Dakotas)

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Chapter News

Call for Papers: Upper Midwest Chapter Expo

Call for Papers:  Upper Midwest Chapter Expo June 22, 2017       

The Upper Midwest Chapter Expo is scheduled for June 22, 2017.


Anyone interested in presenting at the Expo is invited to submit an abstract for consideration. Please send abstracts to Kaitlyn Gherity, kaitlyn@smta.org, by March 25.

We are open to all ideas, and possible suggestions are:

·        New Developments in PCB Technology

·        Conformal Coating/Hydrophobic Coatings

·        2.5/3D Packaging

·        Robotic Laser Soldering

·        Nano-Technology with Polymeric Structures

·        Photonics Integration

·        Flexible Substrates and Flex/Rigid Hybrid Substrates

·        IoT  Manufacturing

·        Industry 4.0 development

·        Manufacturing of Sensors

·        New developments in Board Level Adhesive & Underfills

·        New developments in  Lead free Solders and Interconnect

We look forward to your response!






SMTA Certification

Now available in Minnesota!

SMT Processes- May 2-4, 2017 (Eden Prairie, MN)

·        May 2- Course (8:30-5pm)

·        May 3- ½ day of course + exam

·        May 4- All day exam (8:30-5pm)

Instruction: English 
Test: English 
Instructor: Jim Hall, ITM Consulting

 

For more information, http://www.smta.org/certification/ 






Flexible Circuit Technical Meeting and Facility Tour

The SMTA Upper Midwest Chapter cordially invites you to attend: 

Flexible Circuits Technical Meeting and Facility Tour

Speakers:
Jamin Taylor, All Flex Flexible Circuits
Nick Koop, TTM Technologies
Youngtak Lee, Starkey Laboratories
 
IMPORTANT INFO:
Thursday, December 1, 2016
11:00 a.m.-2:00 p.m. (See agenda below)
Northfield, MN
 
CLICK HERE TO RSVP TODAY!
HURRY:  LIMIT of 50 Attendees!
PRICE:
  • Members:  $25
  • Non-Members:  $30
  • Free for new member application, membership renewal, and displaced worker members
Cost includes lunch, tour and presentations.  Payment is accepted at the door.  Cash or check only.
 
AGENDA:

**  Meeting to begin at Community Resource Bank before moving to All Flex for the facility tour.  Addresses are included below *** 

  • 11:00 a.m.       Registration
  • 11:30 a.m.       Lunch
  • 12:00 p.m.       “ Design and Manufacture of Flexible Circuits” - Jamin Taylor, All Flex Flexible Circuits
  • 12:30 p.m.       “Advanced Solutions & Considerations” - Nick Koop, TTM Technologies
  • 1:00 p.m.         “The Path to Flexible Circuits” - Youngtak Lee, Starkey Laboratories
  • 1:30 p.m.         All Flex Plant Tour     
  • 2:00 p.m.         Adjourn


Community Resource Bank
1605 Heritage Drive
Northfield, MN  55057

All Flex
1705 Cannon Lane
Northfield,  MN  55057

Note: Please be advised that some SMTA members and non-members may be restricted from the plant tour based upon the visitation policies of the sponsoring company and the individual's corporate affiliation. Under no circumstances are these restrictions to perpetrate a discriminatory policy based upon the individual's race, religious beliefs, national origin, or sexual preference.

Preregistration is required by November 28. Admittance without registration will not be allowed.  
Attendance is limited to 50 people.  RSVP today so you don’t get left out in the cold!



Design and Manufacture of Flexible Circuits
INTRODUCTION:
Flexible circuits are used in all electronic markets, and the trend is growing.  The benefits of incorporating a flexible circuit into final designs are numerous.  It is challenging to begin working with flexible circuits, because they are so different from traditional hard boards.  We will discuss materials, design, and manufacturing process of flexible circuits to help Users see the differences and get an idea of how to work with this challenging technology.  

ABOUT JAMIN TAYLOR, All Flex Flexible Circuits:
Jamin Taylor is Director of Sales at All Flex Flexible Circuits.  He has nearly 15 years of experience building, designing, and selling flexible circuits, previously serving as Engineering Manager at Minco Products.  He has his IPC CID certificate and is actively involved in several of the IPC specification committees.
 
Advanced Flex Circuit Solutions & Considerations
 INTRODUCTION:
I will discuss the advantages of rigid flex solutions over conventional wiring, design and cost considerations, as well as HDI and application examples.

ABOUT NICK KOOP, TTM Technologies:
Nick Koop has 30 years of design, manufacturing and management experience in the flexible circuit industry. Nick has developed and applied advanced PCB technologies to support a wide range medical, military, and global security applications. Nick holds a Masters of Science Degree in Management of Technology, and Bachelors Degree of Mechanical Engineering; both from the University of Minnesota. Nick is Chairman of the IPC Flexible Circuits Committee and Co Chair for the IPC 6013 Qualification and Performance Specification for Flexible Printed Boards Subcommittee. Nick is a Senior Field Applications Engineer for TTM Technologies, the largest PCB manufacturer in North America, and one of the top PCB manufacturers in the world.
 
The Starkey Path to Flexible Circuits
INTRODUCTION:
The presentation will cover a general overview of Starkey flexible circuit history, flex technology roadmap, flex designs, FPC defects we normally observe on our parts, and the next generation flex studies we are currently studying and developing. The material is intended to introduce Starkey FPC technology to the audience to get familiarized with our continuous effort to advance our technology.

ABOUT YOUNGTAK LEE, Starkey Laboratories:
Youngtak Lee is currently working as Microelectronics Packaging/Advanced Packaging Engineer at Starkey Laboratories. Youngtak received his Master’s degree in Electrical and Computer Engineering at Georgia Institute of Technology and completed his Ph.D. at Georgia Institute of Technology with the research focused on the design of low power digital circuits, design of low-dropout voltage regulators, research on spintronics and spin-transfer-torque random access memory, and power management with emphasis on adaptability and resiliency. Before the graduate school, he received his Bachelor’s degree in Electrical and Computer Engineering from the University of Virginia. His main interest areas include, but are not limited to, the research, development and exploration of 2.5D & 3D packaging, microelectronic technologies and more reliable next generation flexible printed circuits with new material set, and the development of better processes and improved material sets. He has published a number of papers in peer reviewed journals and conferences in both advanced microelectronics packaging and IC design.
 
Contact Brian Peterson at bpeterson@allflexinc.com or
(507) 663-7162 with questions.
 
CLICK HERE TO RSVP TODAY!
 (50 Attendees Maximum!)
To RSVP, please click here, or copy and paste this address into your browser.

http://www.smta.org/chapters/rsvp.cfm?BEE_ID=4096&BULK_EMAIL_NO=2






SMTA Upper Midwest Chapter Social Media

Want to get up to the minute info on SMTA UMW Chapter events and SMT technology? Connect with us online!

     “Like” our Facebook Page and “Join” our LinkedIn Group






Click on links to view these Upper Mid-West Chapter newsletters:

April 2014 Newsletter
May 2011 Newsletter

March/April 2011 Newsletter
February 2011 Newsletter
June 2010 Newsletter
May 2010 Newsletter
April 2010 Newsletter
July 2009 Newsletter - Golf edition
July 2008 Newsletter
June 2008 Newsletter
May 2008 Newsletter
Mike Carano presentation, Solderable Surface Finishes Overview and Recommendations
Dave Hillman presentation, How PCB Surface Finishes Impact Assembly Processes from an OEM Perspective
March 2008 Newsletter
November 2007 Newsletter
May 2007 Newsletter






Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
April 19, 2016
1:00 pm
DFM Presentation and Tour of Benchmark Electronics Benchmark Electronics 507-453-4773   Mike Havener 
mike.havener@bench.com
June 30, 2016
10:00
Upper Midwest Chapter Expo Marriott Minneapolis Southwest 507-332-9932   Tara Dunn 
tarad@omnipcb.com
July 28, 2016
11:00
Annual Golf Tournament Stonebrooke Golf Club 612-803-2619   Erik Stromberg 
estromberg@e-tronix.com
August 16, 2016
00:00
Chapter Meeting - TBD TBD 507-332-9932   Tara Dunn 
tarad@omnipcb.com
September 25, 2016
00:00
SMTA International Show Chicago, IL 507-332-9932   Tara Dunn 
tarad@omnipcb.com
October 18, 2016
00:00
Chapter Meeting - TBD TBD 507-332-9932   Tara Dunn 
tarad@omnipcb.com
November 15, 2016
00:00
Chapter Meeting - TBD TBD 507-332-9932   Tara Dunn 
tarad@omnipcb.com
May 2, 2017
Certification - SMT Processes - May 2-4 2017 (Eden Prairie, MN) - SMTA Headquarters   Jenny Ng 
June 22, 2017
Vendor-Expo - Upper Midwest 2017 DoubleTree by Hilton Minneapolis - Park Place   Kaitlyn Gherity 


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Our Chapter Leaders

President : Michael Havener  (Benchmark Electronics, MN Division)
Phone : 507-452-8932
Email : mike.havener@bench.com

Vice President : Kris Meacham  (JW Sales, LLC)
Phone : 612-807-4382
Email : kmeacham@salesjw.com

Secretary : Bob Breu  (Bosch Automotive Service Solutions)
Phone : 507-363-6390
Email : bob.breu@us.bosch.com

Treasurer : Erik Stromberg  (E-tronix)
Phone : 612-803-2619
Email : erik@e-tronix.com

VP of Technical Programs : Brian Peterson  (All Flex Flexible Circuits)
Phone : 507-663-7162
Email : bpeterson@allflexinc.com

VP of Membership : Tara Dunn  (Omni PCB)
Phone : 507-332-9932
Email : tarad@omnipcb.com

VP Communications (Appointed) : Alex Zeitler  (NRI Electronics)
Phone : 651-726-1333
Email : azeitler@nrielectronics.com

VP of Operations (Appointed) : Sue Blankenheim  (Omni-Tronics Inc.)
Phone : 763-425-7910
Email : sue@omni-tronics.com

Membership Committee (Appointed) : John P. Japs  (Tonka Electronics, Inc.)
Phone : 952-831-8969
Email : john.japs@tonkaelectronics.com

Board Liaison : Robert Kinyanjui (John Deere Electronic Solutions, Inc.)
Phone Contact : 701-451-3785
Email Address : KinyanjuiRobertK@JohnDeere.com

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Global Participating Members of our Chapter

Creation Technologies Inc.



Corporate Members of our Chapter

3M Company

All Flex Flexible Circuits

Altron, Inc.

Analog Technologies Corporation

Appareo

ASC International

Benchmark Electronics, MN Division

Bergquist Company

BTW Inc.

Circuit Check Inc.

Conductive Containers, Inc.

Control Products Inc.

CyberOptics Corporation

Digi International

Dimation

EI Microcircuits, Inc.

Electronic Systems Inc.

Great Lakes Engineering

Itron, Inc.

John Deere Electronic Solutions, Inc.

KeyTronicEMS

Logic PD

NRI Electronics

Production Automation Corporation

Quality Circuits Inc.

Raven Industries Inc.

RiverSide Electronics Ltd.

Seagate Technology

Solid Design Solutions, Inc.

Sparton Onyx

TEK Products, Inc.

V-Tek, Inc.



SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG Microsoft Corporation NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos Vitronics Soltec USA ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344

Phone 952.920.7682
Fax 952.926.1819
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