Upper Midwest Chapter Tutorial Program
|
|
"Pb-free Reflow and Wave Soldering Guidelines & RoHS Compliance for Europe and China"
Instructor: Rob Rowland, RadiSys Systems
Location: Boston Scientific
4100 Hamline Ave. N.
St. Paul, MN 55112
Date: Tuesday, September 9, 2008
Time: 8AM - 5PM
Cost: The cost is $100/$175 for SMTA members/non-members, and a one-year individual SMTA membership is included in the non-member price.
If you have questions, please contact SMTA chapter coordinator Sara McCabe.
Course Objectives:
Lead-free regulation has been implemented since July 1, 2006 in EU and the implementation data for China is March 1, 2007. Recently, packages such as PBGA (plastic ball grid array), CSP (chip scale package), and especially WLCSP (wafer level CSP) have been very popular for consumer, computer, communication, military, automobile, medical, and mobile products. Most of these packages use solders as their interconnects, thus they are affected by the lead-free regulations!
In this course, some critical issues and their solutions of lead-free soldering (such as the latest EU and China regulations, cost, design, materials, forward- and backward-process incompatibility, inspections, tests, and reliability of components, PCBs, tin whiskers, and solder joints) will be presented. Emphasis is placed on the lead-free critical issues and solutions of the most popular SMT packages such as PQFP, PBGA, CSP, and flip-chip WLCSP.
Most of the materials are based on the instructor’s recently published textbooks, “Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies”, “Electronics Packaging”, “Chip Scale Packages”, “Low-Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies”, “Microvias for Low-Cost High-Density Interconnects”, and “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive Adhesive Materials”. (McGraw-Hill publishes all these books.) Each participant will receive a comprehensive set of handout notes.
Thus, given that the stakes are very high and time is very short, the purpose of this workshop is to assist companies in managing their RoHS risks and in accelerating their RoHS compliance.
Who Should Attend:
This workshop is intended for individuals who are involved RoHS and in the transition to Pb-free reflow and wave soldering RoHS compliant products. The information presented in this workshop will be beneficial to anyone involved with Pb-free reflow and wave soldering and RoHS and Pb-free surface mount assembly including engineers and managers from manufacturing, process, supplier and quality engineering, and manufacturing managers, supervisors, and equipment operators. Some basic knowledge of surface mount technology is helpful but not essential.
COURSE OUTLINE
Pb-free Reflow and Wave Soldering Guidelines
Surface mount soldering processes are challenging and Pb-free soldering adds another level of complexity. This workshop identifies and examines the critical process parameters associated with the transition to Pb-free reflow and wave soldering. Participants will examine these processes from multiple viewpoints including components, substrates, flux, solder alloys and the equipment. The goal is to successfully merge these topics into robust Pb-free reflow and wave soldering processes. Each topic uses a "what changed" approach which explains the differences between SnPb and Pb-free soldering plus the basic theory of operation, recommended operating parameters, monitoring and measuring concepts, and related industry standards.
Soldering profiles should be based on the physical and chemical parameters that influence the soldering process; they should not be developed by trial and error. Reflow soldering profiles are influenced by zone temperature settings and conveyor speed. Wave soldering profiles are influenced by preheat temperature, solder pot temperature and conveyor speed. A time/temperature soldering profile strategy must be developed before a reflow or wave soldering method is defined or equipment is selected. Infrared dominant ovens typically required board specific reflow soldering profiles. Convection dominant ovens are more flexible - a few reflow soldering profiles can cover a range of boards. Wave soldering machine design has not changed much over the past decade but there are some important changes associated with Pb-free wave soldering, especially solder pot and solder alloy compatibility. Four critical factors - substrates, components, flux and solder - influence soldering profiles. This workshop will cover these topics plus time/temperature profiles, zone and preheat parameters, conveyor speed calculation, profiling methods, profiling equipment, mixed alloy soldering and an overview of Pb-free reliability. A list of reflow and wave soldering equipment suppliers is also included.
Topics - This Workshop Covers:
· Steps to creating reflow and wave profiles · Component peak temperature · Component ramp up / ramp down rates · Component surface finish · Tin whisker theory and risk · Moisture sensitive devices · PCB glass transition temperature · PCB coefficient of thermal expansion · PCB material decomposition temperature · PCB time to delamination · PCB surface finish · Flux activation temperature and time · Rosin, water soluble and no-clean flux · Flux classification per J-STD-004 · SnPb and Pb-free solder alloy options · Pb-free solder joint appearance · SnPb and Pb-free soldering scenarios · Mixed alloy soldering situations · Pb-Free BGAs with SnPb Solder · Solder paste basics per J-STD-005 · Stencil apertures and wetting after reflow · Reflow and wave soldering phases · Reflow and wave soldering profiles · Conveyor speed calculation · Reflow oven zone settings · Pb-free solder pots · Pb-free solder joint reliability · Related industry standards
RoHS Compliance for Europe and China
European RoHS was just the beginning. RoHS is becoming a global initiative and China RoHS is next in line. Pb-free gets most of the publicity, but the entire RoHS restricted substance list (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers) must be dealt with to achieve RoHS compliance. This workshop will explain key elements of the European and China RoHS directives including the restricted substance list, concentration values, technical issues and challenges, exemptions, enforcement, labeling, data collection, verifiable objective evidence and material declarations.
Producers are encouraged to have a RoHS Compliance Assurance System (CAS), the purpose of which is to ensure that products and the supply chain are RoHS compliant. The RoHS CAS should have documented processes that cover roles and responsibilities, component and product compliance, verifiable objective evidence, material declarations, supply chain management, inventory control, internal and external audits, and testing. The European Union (EU) released a RoHS Enforcement Guidance Document in May of 2006. This document provides guidance on how the EU intends to monitor and enforce the RoHS Directive. Individual EU member states have their own RoHS enforcement rules and they should align closely with the EU guidance document, which covers enforcement, RoHS compliance documentation and testing.
Material declarations are used to declare material and substance content at the component or product level. They are the centerpiece of a restricted substance data collection and reporting strategy, however the electronics industry has not matured to the point where material declaration information is easy to obtain from manufacturers. Obtaining material declaration information can be a frustrating and time consuming experience even though an IPC standard, IPC-175X, has been available for over a year.
Topics - This Workshop Covers:
· European RoHS Directive · China RoHS Directives · EU and China RoHS Compared · Definitions of RoHS Compliance · RoHS restricted substance list · Maximum concentration value · Homogenous material level · JIG (Joint Industry Group) list · Product groups affected by RoHS · European RoHS exemptions · Lead exemption interpretation · China RoHS labeling options · China RoHS disclosure table · Creating a RoHS compliance strategy · Collecting RoHS compliant information · RoHS compliance and enforcement · Verifiable Objective Evidence (VOE) · RoHS test methods and equipment · Software tools for RoHS compliance · IPC-175X material declaration format · IPC-1752 material declaration classes · Lead-free marking standards
ABOUT THE INSTRUCTOR
 Rob is currently the Supplier Engineering Manager at RadiSys Corporation in Hillsboro, Oregon. Rob has more than 20 years of experience with surface mount manufacturing technology. He is an active member of the Surface Mount Technology Association (SMTA), where he served 2 terms as a chapter president and multiple terms as technical director of SMTA International. In 1999 he received the Founders Award from the SMTA and in 2005 he received a Distinguished Committee Service Award from the IPC for his contributions to IPC-7095A. He was also a member of the Surface Mount Council for nine years. Rob is a frequent author and speaker at industry trade events. He also writes a manufacturing column for SMT Magazine in addition to serving on the editorial advisory board. Rob is the co-author of the book Applied Surface Mount Assembly. He received a Bachelor of Science Degree in Manufacturing Engineering from Weber State University.
Cancellation Policy
Registration fees will be refunded if written notice is postmarked TWO WEEKS prior to the class date. "No Shows" WILL NOT be refunded in order to cover expenses incurred. If someone will be going in your place, please advise the SMTA as soon as possible.
|
|
|
|
Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region.
The purpose is to address the latest information or most recent issues on a specific technology.